NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS.

H. Mikoshiba, T. Homma, K. Hamano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

The technology, which is suitable for submicron VLSI, features bird's beak free, planar surface, low defect generation, and is adaptable to any isolation width from submicron to very large dimensions. The key process steps consist of filling the trench with polysilicon to half of the trench depth by utilizing photoresist etch back, and subsequent full oxidation of the recessed polysilicon to fill the trench by the oxide. Device characteristics examined experimentally are equivalent to those of LOCOS isolated devices. The feasibility of this technology has been verified successfully by fabricating a 64K bit DRAM.

Original languageEnglish
Title of host publicationTechnical Digest - International Electron Devices Meeting
PublisherIEEE
Pages578-581
Number of pages4
Publication statusPublished - 1984
Externally publishedYes

Fingerprint

Polysilicon
Dynamic random access storage
Birds
Photoresists
Oxidation
Defects
Oxides

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mikoshiba, H., Homma, T., & Hamano, K. (1984). NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS. In Technical Digest - International Electron Devices Meeting (pp. 578-581). IEEE.

NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS. / Mikoshiba, H.; Homma, T.; Hamano, K.

Technical Digest - International Electron Devices Meeting. IEEE, 1984. p. 578-581.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mikoshiba, H, Homma, T & Hamano, K 1984, NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS. in Technical Digest - International Electron Devices Meeting. IEEE, pp. 578-581.
Mikoshiba H, Homma T, Hamano K. NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS. In Technical Digest - International Electron Devices Meeting. IEEE. 1984. p. 578-581
Mikoshiba, H. ; Homma, T. ; Hamano, K. / NEW TRENCH ISOLATION TECHNOLOGY AS A REPLACEMENT OF LOCOS. Technical Digest - International Electron Devices Meeting. IEEE, 1984. pp. 578-581
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