Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue

Yoshiharu Kariya, Minoru Mukai

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)150-155
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume8
Issue number2
DOIs
Publication statusPublished - 2005
Externally publishedYes

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Thermal fatigue
Soldering alloys
Mechanical properties

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue. / Kariya, Yoshiharu; Mukai, Minoru.

In: Journal of Japan Institute of Electronics Packaging, Vol. 8, No. 2, 2005, p. 150-155.

Research output: Contribution to journalArticle

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