Nonlinear Mechanical Properties of Solder Alloys and Reliability Design for Thermal Fatigue

Yoshiharu Kariya, Minoru Mukai

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)150-155
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume8
Issue number2
DOIs
Publication statusPublished - 2005
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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