Novel fabrication technology for ultra-compact three-dimensional MMICs

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Kimiyoshi Yamasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.

Original languageEnglish
Title of host publicationEuropean Solid-State Device Research Conference
PublisherIEEE Computer Society
Pages280-283
Number of pages4
ISBN (Print)2863322214
DOIs
Publication statusPublished - 1997
Externally publishedYes
Event27th European Solid-State Device Research Conference, ESSDERC 1997 - Stuttgart
Duration: 1997 Sep 221997 Sep 24

Other

Other27th European Solid-State Device Research Conference, ESSDERC 1997
CityStuttgart
Period97/9/2297/9/24

Fingerprint

Monolithic microwave integrated circuits
Fabrication
Plasma etching
Inductively coupled plasma
Masks

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Sugitani, S., Onodera, K., Aoyama, S., Hirano, M., & Yamasaki, K. (1997). Novel fabrication technology for ultra-compact three-dimensional MMICs. In European Solid-State Device Research Conference (pp. 280-283). IEEE Computer Society. https://doi.org/10.1109/ESSDERC.1997.194420

Novel fabrication technology for ultra-compact three-dimensional MMICs. / Sugitani, Suehiro; Onodera, Kiyomitsu; Aoyama, Shinji; Hirano, Makoto; Yamasaki, Kimiyoshi.

European Solid-State Device Research Conference. IEEE Computer Society, 1997. p. 280-283.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sugitani, S, Onodera, K, Aoyama, S, Hirano, M & Yamasaki, K 1997, Novel fabrication technology for ultra-compact three-dimensional MMICs. in European Solid-State Device Research Conference. IEEE Computer Society, pp. 280-283, 27th European Solid-State Device Research Conference, ESSDERC 1997, Stuttgart, 97/9/22. https://doi.org/10.1109/ESSDERC.1997.194420
Sugitani S, Onodera K, Aoyama S, Hirano M, Yamasaki K. Novel fabrication technology for ultra-compact three-dimensional MMICs. In European Solid-State Device Research Conference. IEEE Computer Society. 1997. p. 280-283 https://doi.org/10.1109/ESSDERC.1997.194420
Sugitani, Suehiro ; Onodera, Kiyomitsu ; Aoyama, Shinji ; Hirano, Makoto ; Yamasaki, Kimiyoshi. / Novel fabrication technology for ultra-compact three-dimensional MMICs. European Solid-State Device Research Conference. IEEE Computer Society, 1997. pp. 280-283
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