Novel fabrication technology for ultra-compact three-dimensional MMICs

Suehiro Sugitani; Kiyomitsu Onodera; Shinji Aoyama; Makoto Hirano; Kimiyoshi Yamasaki

doi:10.1109/ESSDERC.1997.194420

Novel fabrication technology for ultra-compact three-dimensional MMICs

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Kimiyoshi Yamasaki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.

Original language	English
Title of host publication	European Solid-State Device Research Conference
Editors	H. Grunbacher
Publisher	IEEE Computer Society
Pages	280-283
Number of pages	4
ISBN (Electronic)	2863322214
DOIs	https://doi.org/10.1109/ESSDERC.1997.194420
Publication status	Published - 1997 Jan 1
Event	27th European Solid-State Device Research Conference, ESSDERC 1997 - Stuttgart, Germany Duration: 1997 Sept 22 → 1997 Sept 24

Publication series

Name	European Solid-State Device Research Conference
ISSN (Print)	1930-8876

Conference

Conference	27th European Solid-State Device Research Conference, ESSDERC 1997
Country/Territory	Germany
City	Stuttgart
Period	97/9/22 → 97/9/24

ASJC Scopus subject areas

Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality

Access to Document

10.1109/ESSDERC.1997.194420

Cite this

Novel fabrication technology for ultra-compact three-dimensional MMICs. / Sugitani, Suehiro; Onodera, Kiyomitsu; Aoyama, Shinji et al.

European Solid-State Device Research Conference. ed. / H. Grunbacher. IEEE Computer Society, 1997. p. 280-283 (European Solid-State Device Research Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sugitani, S, Onodera, K, Aoyama, S, Hirano, M & Yamasaki, K 1997, Novel fabrication technology for ultra-compact three-dimensional MMICs. in H Grunbacher (ed.), European Solid-State Device Research Conference. European Solid-State Device Research Conference, IEEE Computer Society, pp. 280-283, 27th European Solid-State Device Research Conference, ESSDERC 1997, Stuttgart, Germany, 97/9/22. https://doi.org/10.1109/ESSDERC.1997.194420

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abstract = "A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.",

author = "Suehiro Sugitani and Kiyomitsu Onodera and Shinji Aoyama and Makoto Hirano and Kimiyoshi Yamasaki",

year = "1997",

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doi = "10.1109/ESSDERC.1997.194420",

language = "English",

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AU - Hirano, Makoto

AU - Yamasaki, Kimiyoshi

PY - 1997/1/1

Y1 - 1997/1/1

N2 - A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.

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M3 - Conference contribution

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BT - European Solid-State Device Research Conference

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Y2 - 22 September 1997 through 24 September 1997

ER -

Novel fabrication technology for ultra-compact three-dimensional MMICs

Abstract

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ASJC Scopus subject areas

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