Novel fabrication technology for ultra-compact three-dimensional MMICs

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Kimiyoshi Yamasaki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.

    Original languageEnglish
    Title of host publicationEuropean Solid-State Device Research Conference
    EditorsH. Grunbacher
    PublisherIEEE Computer Society
    Pages280-283
    Number of pages4
    ISBN (Electronic)2863322214
    DOIs
    Publication statusPublished - 1997 Jan 1
    Event27th European Solid-State Device Research Conference, ESSDERC 1997 - Stuttgart, Germany
    Duration: 1997 Sep 221997 Sep 24

    Publication series

    NameEuropean Solid-State Device Research Conference
    ISSN (Print)1930-8876

    Conference

    Conference27th European Solid-State Device Research Conference, ESSDERC 1997
    CountryGermany
    CityStuttgart
    Period97/9/2297/9/24

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Safety, Risk, Reliability and Quality

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  • Cite this

    Sugitani, S., Onodera, K., Aoyama, S., Hirano, M., & Yamasaki, K. (1997). Novel fabrication technology for ultra-compact three-dimensional MMICs. In H. Grunbacher (Ed.), European Solid-State Device Research Conference (pp. 280-283). (European Solid-State Device Research Conference). IEEE Computer Society. https://doi.org/10.1109/ESSDERC.1997.194420