Novel interconnection technology for three-dimensional MMICs

Makoto Hirano, Suehiro Sugitani, Shinji Aoyama, Kiyomitsu Onodera

    Research output: Contribution to journalArticle

    Abstract

    A novel fabrication technology has been developed to implement three-dimensional MMICs. This technology enables us to form a three-dimensional structure of interconnections in a 10-μm-thick polyimide insulator matrix ; for example, four horizontal metal layers, pillar-like vertical vias, and wall-like vertical microwires for shielding as a ground plane. Many passive elements and circuits can be formed in a small area in multiple levels with vertical structures, not only on GaAs IC chips but also on Si IC chips. Si masterslice MMIC, which are a typical example of three-dimensional MMICs, can be fabricated using this technology.

    Original languageEnglish
    Pages (from-to)1277-1283
    Number of pages7
    JournalNTT R and D
    Volume45
    Issue number12
    Publication statusPublished - 1996 Dec 1

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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  • Cite this

    Hirano, M., Sugitani, S., Aoyama, S., & Onodera, K. (1996). Novel interconnection technology for three-dimensional MMICs. NTT R and D, 45(12), 1277-1283.