TY - GEN
T1 - Novel structure and fabrication of an energy harvesting device based on vibration-oriented generation for low oscillation operation
AU - Suzuki, Takafumi
AU - Nagasawa, Sumito
AU - Okamoto, Hiroshi
AU - Kuwano, Hiroki
PY - 2009/12/1
Y1 - 2009/12/1
N2 - We propose and implemented a novel structure and fabrication method of a micro energy harvesting device based on vibration-driven power generation that matches the surrounding oscillation frequency. When the micro energy harvesting device vibrates at its own resonant frequency, its output maximizes. However, a micro device usually has a high resonant frequency, because of the size. We succeeded in lowering the resonant frequency without scaling-up the device using Si micromachining technology. We propose a structure in which a polymer with a low Young's modulus is embedded in a Hybrid Silicon Micro Structure (HSMS). We applied the structure to a micro cantilever generator with an electret that is 3.5 mm long, 1.0 mm wide and 115 μm thick. We demonstrated that the HSMS generator has a low resonant frequency and consequently is efficient at low frequencies.
AB - We propose and implemented a novel structure and fabrication method of a micro energy harvesting device based on vibration-driven power generation that matches the surrounding oscillation frequency. When the micro energy harvesting device vibrates at its own resonant frequency, its output maximizes. However, a micro device usually has a high resonant frequency, because of the size. We succeeded in lowering the resonant frequency without scaling-up the device using Si micromachining technology. We propose a structure in which a polymer with a low Young's modulus is embedded in a Hybrid Silicon Micro Structure (HSMS). We applied the structure to a micro cantilever generator with an electret that is 3.5 mm long, 1.0 mm wide and 115 μm thick. We demonstrated that the HSMS generator has a low resonant frequency and consequently is efficient at low frequencies.
UR - http://www.scopus.com/inward/record.url?scp=77951105514&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77951105514&partnerID=8YFLogxK
U2 - 10.1109/ICSENS.2009.5398426
DO - 10.1109/ICSENS.2009.5398426
M3 - Conference contribution
AN - SCOPUS:77951105514
SN - 9781424445486
T3 - Proceedings of IEEE Sensors
SP - 1832
EP - 1835
BT - IEEE Sensors 2009 Conference - SENSORS 2009
T2 - IEEE Sensors 2009 Conference - SENSORS 2009
Y2 - 25 October 2009 through 28 October 2009
ER -