Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

Original languageEnglish
Pages (from-to)61-69
Number of pages9
JournalIEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volume19
Issue number1
DOIs
Publication statusPublished - 1996 Jan 1

ASJC Scopus subject areas

  • Engineering(all)

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