Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

Original languageEnglish
Pages (from-to)61-69
Number of pages9
JournalIEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volume19
Issue number1
DOIs
Publication statusPublished - 1996 Jan

Fingerprint

Soldering
Plastics
Cracks
Moisture
Bearing pads
Shear strength
Shear stress
Atmospheric humidity
Resins
Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako; Sudo, Toshio.

In: IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, Vol. 19, No. 1, 01.1996, p. 61-69.

Research output: Contribution to journalArticle

@article{7750978cbe464358a1e03cb97860af07,
title = "Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package",
abstract = "A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85{\%} relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.",
author = "Tsutomu Nakazawa and Yumi Inoue and Kanako Sawada and Toshio Sudo",
year = "1996",
month = "1",
doi = "10.1109/3476.484206",
language = "English",
volume = "19",
pages = "61--69",
journal = "IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing",
issn = "1083-4400",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

TY - JOUR

T1 - Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

AU - Nakazawa, Tsutomu

AU - Inoue, Yumi

AU - Sawada, Kanako

AU - Sudo, Toshio

PY - 1996/1

Y1 - 1996/1

N2 - A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

AB - A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

UR - http://www.scopus.com/inward/record.url?scp=0029753386&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029753386&partnerID=8YFLogxK

U2 - 10.1109/3476.484206

DO - 10.1109/3476.484206

M3 - Article

AN - SCOPUS:0029753386

VL - 19

SP - 61

EP - 69

JO - IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

JF - IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

SN - 1083-4400

IS - 1

ER -