Abstract
A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
Original language | English |
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Pages (from-to) | 61-69 |
Number of pages | 9 |
Journal | IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing |
Volume | 19 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1996 Jan 1 |
ASJC Scopus subject areas
- Engineering(all)