Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa; Yumi Inoue; Kanako Sawada; Toshio Sudo

doi:10.1109/3476.484206

Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Electrical Engineering and Computer Science

Research output: Contribution to journal › Article

3 Citations (Scopus)

Abstract

A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

Original language	English
Pages (from-to)	61-69
Number of pages	9
Journal	IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volume	19
Issue number	1
DOIs	https://doi.org/10.1109/3476.484206
Publication status	Published - 1996 Jan 1

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ASJC Scopus subject areas

Engineering(all)

Cite this

Nakazawa, T., Inoue, Y., Sawada, K., & Sudo, T. (1996). Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package. IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 19(1), 61-69. https://doi.org/10.1109/3476.484206

Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako; Sudo, Toshio.

In: IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, Vol. 19, No. 1, 01.01.1996, p. 61-69.

Research output: Contribution to journal › Article

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Access to Document

10.1109/3476.484206