Abstract
A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
| Original language | English |
|---|---|
| Pages (from-to) | 61-69 |
| Number of pages | 9 |
| Journal | IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing |
| Volume | 19 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1996 Jan |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako; Sudo, Toshio.
In: IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, Vol. 19, No. 1, 01.1996, p. 61-69.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package
AU - Nakazawa, Tsutomu
AU - Inoue, Yumi
AU - Sawada, Kanako
AU - Sudo, Toshio
PY - 1996/1
Y1 - 1996/1
N2 - A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
AB - A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
UR - http://www.scopus.com/inward/record.url?scp=0029753386&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0029753386&partnerID=8YFLogxK
U2 - 10.1109/3476.484206
DO - 10.1109/3476.484206
M3 - Article
AN - SCOPUS:0029753386
VL - 19
SP - 61
EP - 69
JO - IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
JF - IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
SN - 1083-4400
IS - 1
ER -