Abstract
A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
| Original language | English |
|---|---|
| Pages (from-to) | 61-69 |
| Number of pages | 9 |
| Journal | IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing |
| Volume | 19 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1996 Jan 1 |
ASJC Scopus subject areas
- Engineering(all)
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Cite this
Nakazawa, T., Inoue, Y., Sawada, K., & Sudo, T. (1996). Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package. IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 19(1), 61-69. https://doi.org/10.1109/3476.484206