Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

Original languageEnglish
Title of host publicationProceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages310-317
Number of pages8
Publication statusPublished - 1995
EventProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityAustin, TX, USA
Period95/10/295/10/4

Fingerprint

Soldering
Shear stress
Plastics
Cracks
Bond strength (materials)
Delamination
Thermal stress
Shear strength
Finite element method

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Nakazawa, T., Inoue, Y., Sawada, K., & Sudo, T. (1995). Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. In Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium (pp. 310-317). Piscataway, NJ, United States: IEEE.

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako; Sudo, Toshio.

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States : IEEE, 1995. p. 310-317.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nakazawa, T, Inoue, Y, Sawada, K & Sudo, T 1995, Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. in Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. IEEE, Piscataway, NJ, United States, pp. 310-317, Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA, 95/10/2.
Nakazawa T, Inoue Y, Sawada K, Sudo T. Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. In Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States: IEEE. 1995. p. 310-317
Nakazawa, Tsutomu ; Inoue, Yumi ; Sawada, Kanako ; Sudo, Toshio. / Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States : IEEE, 1995. pp. 310-317
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