Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

Research output: Contribution to conferencePaper

Abstract

This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

Original languageEnglish
Pages310-317
Number of pages8
Publication statusPublished - 1995 Dec 1
EventProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityAustin, TX, USA
Period95/10/295/10/4

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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    Nakazawa, T., Inoue, Y., Sawada, K., & Sudo, T. (1995). Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. 310-317. Paper presented at Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA, .