Numerical analysis of AC loss characteristics of multi-layer HTS cable assembled by coated conductors

Satoshi Fukui, Jun Ogawa, Nobuya Suzuki, Tetsuo Oka, Takao Sato, Osami Tsukamoto, Tomoaki Takao

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

In this paper, effects of geometrical configuration on AC loss characteristics of cable conductors assembled by multiple YBCO tape in polygonal arrangement were numerically studied. The previously developed numerical model was modified to analyze the AC loss in the HTS tape in the polygonally assembled multi-layer cable. By using the numerical model, the influences of the cable geometrical parameters, especially the effects of the tape width and the tape-to-tape gap, on AC loss properties were evaluated.

Original languageEnglish
Article number4982598
Pages (from-to)1714-1717
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume19
Issue number3
DOIs
Publication statusPublished - 2009 Jun 1
Externally publishedYes

Fingerprint

Tapes
cables
tapes
numerical analysis
Numerical analysis
alternating current
Cables
conductors
Numerical models
configurations

Keywords

  • AC loss
  • Polygonal cable
  • Power transmission cable
  • YBCO tape

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Numerical analysis of AC loss characteristics of multi-layer HTS cable assembled by coated conductors. / Fukui, Satoshi; Ogawa, Jun; Suzuki, Nobuya; Oka, Tetsuo; Sato, Takao; Tsukamoto, Osami; Takao, Tomoaki.

In: IEEE Transactions on Applied Superconductivity, Vol. 19, No. 3, 4982598, 01.06.2009, p. 1714-1717.

Research output: Contribution to journalArticle

Fukui, Satoshi ; Ogawa, Jun ; Suzuki, Nobuya ; Oka, Tetsuo ; Sato, Takao ; Tsukamoto, Osami ; Takao, Tomoaki. / Numerical analysis of AC loss characteristics of multi-layer HTS cable assembled by coated conductors. In: IEEE Transactions on Applied Superconductivity. 2009 ; Vol. 19, No. 3. pp. 1714-1717.
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