Numerical stress evaluations of bulk superconductors with resin impregnation

M. Tsuchimoto, H. Takashima, M. Tomita, Masato Murakami

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Stresses in a bulk high-temperature superconductor with resin impregnation are numerically evaluated during the magnetization process by field cooling. Shielding current distributions are obtained through a macroscopic numerical simulation with the Maxwell equations and the critical state model. The stress distributions are obtained through numerical analysis with the finite-element method. The stress distributions of the resin impregnation model are evaluated for the fixed boundary condition of the bulk HTS. The maximum stresses are obtained on the boundary of the resin-impregnated region.

Original languageEnglish
Pages (from-to)718-721
Number of pages4
JournalPhysica C: Superconductivity and its Applications
Volume378-381
Issue numberPART 1
DOIs
Publication statusPublished - 2002 Oct 1
Externally publishedYes

Fingerprint

Impregnation
resins
Superconducting materials
Resins
stress distribution
Stress concentration
evaluation
High temperature superconductors
Maxwell equations
current distribution
high temperature superconductors
Maxwell equation
Shielding
numerical analysis
shielding
Numerical analysis
Magnetization
finite element method
Boundary conditions
boundary conditions

Keywords

  • Bulk HTS
  • Field-cooled magnetization
  • Resin impregnation
  • Stress

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this

Numerical stress evaluations of bulk superconductors with resin impregnation. / Tsuchimoto, M.; Takashima, H.; Tomita, M.; Murakami, Masato.

In: Physica C: Superconductivity and its Applications, Vol. 378-381, No. PART 1, 01.10.2002, p. 718-721.

Research output: Contribution to journalArticle

Tsuchimoto, M. ; Takashima, H. ; Tomita, M. ; Murakami, Masato. / Numerical stress evaluations of bulk superconductors with resin impregnation. In: Physica C: Superconductivity and its Applications. 2002 ; Vol. 378-381, No. PART 1. pp. 718-721.
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