Observation of stress field around an oscillating crack tip in a quenched thin glass plate

S. Yoneyama, K. Sakaue, H. Kikuta, M. Takashi

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

The variation of stress field around an oscillating crack tip in a quenched thin glass plate is observed using instantaneous phase-stepping photoelasticity. The successive images around the propagating crack are recorded by a CCD camera that is equipped with a pixelated micro-retarder array. Then, the phase maps of the principal stress difference and the principal direction are easily obtained even though the photoelastic fringes cannot be visualized. The path of the crack growth as well as the stress intensity factors and the crack tip constraint are obtained from these phase distributions. Results show that the mode I stress intensity factor and the crack tip constraint vary remarkably with the crack growth. In addition, the results show that the mode-II stress intensity factor exists even though the crack propagates smoothly.

Original languageEnglish
Pages (from-to)367-374
Number of pages8
JournalExperimental Mechanics
Volume48
Issue number3
DOIs
Publication statusPublished - 2008 Jun 1

Keywords

  • Fracture mechanics
  • Instantaneous phase-stepping method
  • Mixed-mode
  • Oscillating crack
  • Photoelasticity
  • Quasi-static crack
  • Quenched glass
  • Stress intensity factor
  • T-stress
  • Thermal stress

ASJC Scopus subject areas

  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

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