Observation of stress field around an oscillating crack tip in a quenched thin glass plate

S. Yoneyama, Kenichi Sakaue, H. Kikuta, M. Takashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

The variation of stress field around an oscillating crack tip in a quenched thin glass plate is observed using instantaneous phase-stepping photoelasticity. The successive images around the propagating crack are recorded by a CCD camera that is equipped with a pixelated microretarder array. Then, the phase maps of the principal stress difference and the principal direction are easily obtained even though the photoelastic fringes cannot be visualized. The path of the crack growth as well as the stress intensity factors and the crack tip constraint are obtained from these phase distributions. Results show that the mode I stress intensity factor and the crack tip constraint vary remarkably with the crack growth. In addition, the results show that the mode-II stress intensity factor exists even though the crack propagates smoothly.

Original languageEnglish
Title of host publicationProceedings of the Society for Experimental Mechanics, Inc.
Pages367-374
Number of pages8
Volume65
Publication statusPublished - 2008
Externally publishedYes

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Keywords

  • Fracture mechanics
  • Instantaneous phase-stepping method
  • Mixed-mode
  • Oscillating crack
  • Photoelasticity
  • Quasi-static crack
  • Quenched glass
  • Stress intensity factor
  • T-stress
  • Thermal stress

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Yoneyama, S., Sakaue, K., Kikuta, H., & Takashi, M. (2008). Observation of stress field around an oscillating crack tip in a quenched thin glass plate. In Proceedings of the Society for Experimental Mechanics, Inc. (Vol. 65, pp. 367-374)