On-board snubber circuit for damping of anti-resonance peak in total PDN

Toma Yamaguchi, Kanae Kurita, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Power supply noise is a serious issue for advanced CMOS LSIs and systems, since the performance of LSI chip is becoming more sensitive to power supply fluctuation under the lower power supply voltage. Because power supply noises are strongly related to the anti-resonance peak frequency in the total power distribution network (PDN), suppressing the anti-resonance peak is one of the most important design concerns. In this paper, the on-board snubber circuits (RC series circuits) has been studied to suppress the anti-resonance peak. The optimal circuit parameters of the on-board snubber circuits such as capacitance (Csnb) and resistance (Rdmp) were derived for quad flat package (QFP) and ball grid array (BGA) to effectively suppress the anti-resonance peak of the total PDN impedance. As a result, the settling time of power supply noises were greatly decreased. Furthermore, clock frequency dependency of power supply noise was also significantly decreased.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages91-94
Number of pages4
ISBN (Print)9781479961955
DOIs
Publication statusPublished - 2015 Jan 13
Event2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto
Duration: 2014 Nov 42014 Nov 6

Other

Other2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CityKyoto
Period14/11/414/11/6

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Yamaguchi, T., Kurita, K., & Sudo, T. (2015). On-board snubber circuit for damping of anti-resonance peak in total PDN. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 91-94). [7009617] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009617