Abstract
This research examined the possibility of optimizing airflow performance of cleanrooms with FOUP (Front Opening Unified Pod) systems used in 300mm wafer lines for VLSI production. Numerical simulations using computational fluid dynamics (CFD) were carried out to obtain airflow states in cleanrooms with various design conditions. Each result was evaluated using a new quantification method and the cleanroom performance was then compared to it. The proposed method was based on the idea of Scale for Ventilation Efficiency (SVE), which is used to measure building ventilation. It enabled quantitative evaluation of the airflow performance independent from other factors and could be used to help design optimal cleanrooms. The study found that cleanroom performance changes with varying supply types and filter coverage, and that there is a proper combination of these parameters. Therefore, it is possible to develop the most efficient FOUP cleanroom system using this method.
Original language | English |
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Pages (from-to) | 257-261 |
Number of pages | 5 |
Journal | Journal of Asian Architecture and Building Engineering |
Volume | 10 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2011 |
Externally published | Yes |
Keywords
- 300mm wafer lines
- Airflow performance
- CFD techniques
- Cleanroom
- FOUP system; SVE
ASJC Scopus subject areas
- Civil and Structural Engineering
- Architecture
- Cultural Studies
- Building and Construction
- Arts and Humanities (miscellaneous)