Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise

Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)435-440
Journal7th IMC
Publication statusPublished - 1992 Apr 1

Cite this

Y.Hiruta, Y. H., N.Hirano, N. H., T.Sudo, T. S., & Sudo, T. (1992). Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise. 7th IMC, 435-440.

Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise. / Y.Hiruta, Y.Hiruta; N.Hirano, N.Hirano; T.Sudo, T.Sudo; Sudo, Toshio.

In: 7th IMC, 01.04.1992, p. 435-440.

Research output: Contribution to journalArticle

Y.Hiruta, YH, N.Hirano, NH, T.Sudo, TS & Sudo, T 1992, 'Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise', 7th IMC, pp. 435-440.
Y.Hiruta, Y.Hiruta ; N.Hirano, N.Hirano ; T.Sudo, T.Sudo ; Sudo, Toshio. / Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise. In: 7th IMC. 1992 ; pp. 435-440.
@article{2c38104d52c640fda3fe44de4bba10f9,
title = "Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise",
author = "Y.Hiruta Y.Hiruta and N.Hirano N.Hirano and T.Sudo T.Sudo and Toshio Sudo",
year = "1992",
month = "4",
day = "1",
language = "English",
pages = "435--440",
journal = "7th IMC",

}

TY - JOUR

T1 - Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise

AU - Y.Hiruta, Y.Hiruta

AU - N.Hirano, N.Hirano

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1992/4/1

Y1 - 1992/4/1

M3 - Article

SP - 435

EP - 440

JO - 7th IMC

JF - 7th IMC

ER -