Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise

Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)435-440
Journal7th IMC
Publication statusPublished - 1992 Apr 1

Cite this

Y.Hiruta, Y. H., N.Hirano, N. H., T.Sudo, T. S., & Sudo, T. (1992). Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise. 7th IMC, 435-440.