Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise

Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Cite this

@article{2c38104d52c640fda3fe44de4bba10f9,

title = "Optimized Ground Pin Assignment in a Multi-layer Package to Minimize Simultaneous Switching Noise",

author = "Y.Hiruta Y.Hiruta and N.Hirano N.Hirano and T.Sudo T.Sudo and Toshio Sudo",

year = "1992",

month = apr,

day = "1",

language = "English",

pages = "435--440",

journal = "７th IMC",

}