Overview of MCM/KGD development activities in Japan

Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The MCM/KGD study group in EIAJ (Electronic Industries Association of Japan) surveyed the activities on MCM related technologies and the future perspectives up to 2010. The high-density packaging technology had been driven by supercomputers and mainframes for a long time. Recently, high performance microporcessors become available for consumer products such PDAs (personal digital assistants), Notebook PCs (personal computers), digital cameras and so on. Then, MCM is a key technology to make these consumer products smaller, lighter and thinner. Area array packages such as BGA (ball grid array), CSP (chip scale package) are key components to reduce the occupied area. Wafer-level CSP will be a new approach to supply KGD in a minimum assembly cost by handling in a water level instead of a die level. Build-up type printed circuit board is essential to mount both CSPs and flip-chipped dies with fine-pitch I/O terminals. Test methodology for burn-in and testing must be improved to provide low cost KGD (Known good die) in the future.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages805-809
Number of pages5
Publication statusPublished - 2000

Fingerprint

Multicarrier modulation
Chip scale packages
Consumer products
Laptop computers
Ball grid arrays
Supercomputers
Electronics industry
Personal digital assistants
Digital cameras
Water levels
Personal computers
Printed circuit boards
Costs
Packaging
Testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sudo, T. (2000). Overview of MCM/KGD development activities in Japan. In Proceedings - Electronic Components and Technology Conference (pp. 805-809). IEEE.

Overview of MCM/KGD development activities in Japan. / Sudo, Toshio.

Proceedings - Electronic Components and Technology Conference. IEEE, 2000. p. 805-809.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sudo, T 2000, Overview of MCM/KGD development activities in Japan. in Proceedings - Electronic Components and Technology Conference. IEEE, pp. 805-809.
Sudo T. Overview of MCM/KGD development activities in Japan. In Proceedings - Electronic Components and Technology Conference. IEEE. 2000. p. 805-809
Sudo, Toshio. / Overview of MCM/KGD development activities in Japan. Proceedings - Electronic Components and Technology Conference. IEEE, 2000. pp. 805-809
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