Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Ploybussara Gomasang; Satoru Ogiue; Kazuyoshi Ueno; Shinji Yokogawa

doi:10.1109/IITC.2018.8430461

Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Ploybussara Gomasang, Satoru Ogiue, Kazuyoshi Ueno, Shinji Yokogawa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu₂0, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu₂0 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

Original language	English
Title of host publication	2018 IEEE International Interconnect Technology Conference, IITC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	112-114
Number of pages	3
ISBN (Print)	9781538643372
DOIs	https://doi.org/10.1109/IITC.2018.8430461
Publication status	Published - 2018 Aug 8
Event	2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States Duration: 2018 Jun 4 → 2018 Jun 7

Other

Other	2018 IEEE International Interconnect Technology Conference, IITC 2018
Country	United States
City	Santa Clara
Period	18/6/4 → 18/6/7

Keywords

Cu metallization
Cu oxidation
lifetime
XPS

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/IITC.2018.8430461

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Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity. / Gomasang, Ploybussara; Ogiue, Satoru; Ueno, Kazuyoshi; Yokogawa, Shinji.

2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 112-114 8430461.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Gomasang, P, Ogiue, S, Ueno, K & Yokogawa, S 2018, Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity. in 2018 IEEE International Interconnect Technology Conference, IITC 2018., 8430461, Institute of Electrical and Electronics Engineers Inc., pp. 112-114, 2018 IEEE International Interconnect Technology Conference, IITC 2018, Santa Clara, United States, 18/6/4. https://doi.org/10.1109/IITC.2018.8430461

@inproceedings{88455ed124b44429ab5cb550d2f3978e,

title = "Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity",

abstract = "Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.",

keywords = "Cu metallization, Cu oxidation, lifetime, XPS",

author = "Ploybussara Gomasang and Satoru Ogiue and Kazuyoshi Ueno and Shinji Yokogawa",

year = "2018",

month = aug,

day = "8",

doi = "10.1109/IITC.2018.8430461",

language = "English",

isbn = "9781538643372",

pages = "112--114",

booktitle = "2018 IEEE International Interconnect Technology Conference, IITC 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2018 IEEE International Interconnect Technology Conference, IITC 2018 ; Conference date: 04-06-2018 Through 07-06-2018",

}

TY - GEN

T1 - Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

AU - Gomasang, Ploybussara

AU - Ogiue, Satoru

AU - Ueno, Kazuyoshi

AU - Yokogawa, Shinji

PY - 2018/8/8

Y1 - 2018/8/8

N2 - Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

AB - Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

KW - Cu metallization

KW - Cu oxidation

KW - lifetime

KW - XPS

UR - http://www.scopus.com/inward/record.url?scp=85052496310&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85052496310&partnerID=8YFLogxK

U2 - 10.1109/IITC.2018.8430461

DO - 10.1109/IITC.2018.8430461

M3 - Conference contribution

AN - SCOPUS:85052496310

SN - 9781538643372

SP - 112

EP - 114

BT - 2018 IEEE International Interconnect Technology Conference, IITC 2018

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 IEEE International Interconnect Technology Conference, IITC 2018

Y2 - 4 June 2018 through 7 June 2018

ER -