Abstract
Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.
Original language | English |
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Title of host publication | 2018 IEEE International Interconnect Technology Conference, IITC 2018 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 112-114 |
Number of pages | 3 |
ISBN (Print) | 9781538643372 |
DOIs | |
Publication status | Published - 2018 Aug 8 |
Event | 2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States Duration: 2018 Jun 4 → 2018 Jun 7 |
Other
Other | 2018 IEEE International Interconnect Technology Conference, IITC 2018 |
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Country | United States |
City | Santa Clara |
Period | 18/6/4 → 18/6/7 |
Keywords
- Cu metallization
- Cu oxidation
- lifetime
- XPS
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials