Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Ploybussara Gomasang, Satoru Ogiue, Kazuyoshi Ueno, Shinji Yokogawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.

Original languageEnglish
Title of host publication2018 IEEE International Interconnect Technology Conference, IITC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages112-114
Number of pages3
ISBN (Print)9781538643372
DOIs
Publication statusPublished - 2018 Aug 8
Event2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States
Duration: 2018 Jun 42018 Jun 7

Other

Other2018 IEEE International Interconnect Technology Conference, IITC 2018
CountryUnited States
CitySanta Clara
Period18/6/418/6/7

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Keywords

  • Cu metallization
  • Cu oxidation
  • lifetime
  • XPS

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Gomasang, P., Ogiue, S., Ueno, K., & Yokogawa, S. (2018). Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity. In 2018 IEEE International Interconnect Technology Conference, IITC 2018 (pp. 112-114). [8430461] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.2018.8430461