TY - GEN
T1 - Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity
AU - Gomasang, Ploybussara
AU - Ogiue, Satoru
AU - Ueno, Kazuyoshi
AU - Yokogawa, Shinji
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by CREST, JST. Grant Number JPMJCR1532 A part of this work was supported by JSPS KAKENHI Grant Number JP17H06293 and JP15H01786. This presentation was supported by SIT Research Center for Green Innovation.
PY - 2018/8/8
Y1 - 2018/8/8
N2 - Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.
AB - Nonlinear dependence of sheet resistance change for Cu film on humidity was observed during temperature humidity storage (THS) test to evaluate the lifetime of Cu film in long-term storage in an environment. X-ray photoelectron spectroscopy (XPS) was adopted to investigate the change of oxidation structure depending on the humidity. Relative volume ratio of Cu, Cu20, and CuO was considered as the reason for the nonlinear dependence. The dominant reaction of oxidation changed from Cu20 to CuO between 75 and 85% relative humidity (RH) at 85 °C, leading to almost no reduction of Cu film thickness in spite of higher humidity.
KW - Cu metallization
KW - Cu oxidation
KW - XPS
KW - lifetime
UR - http://www.scopus.com/inward/record.url?scp=85052496310&partnerID=8YFLogxK
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U2 - 10.1109/IITC.2018.8430461
DO - 10.1109/IITC.2018.8430461
M3 - Conference contribution
AN - SCOPUS:85052496310
SN - 9781538643372
T3 - 2018 IEEE International Interconnect Technology Conference, IITC 2018
SP - 112
EP - 114
BT - 2018 IEEE International Interconnect Technology Conference, IITC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Interconnect Technology Conference, IITC 2018
Y2 - 4 June 2018 through 7 June 2018
ER -