Package deformation and cracking mechanism due to reflow soldering

Kanako Sawada, Tsutomu Nakazawa, Noriyasu Kawamura, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

Plastic package cracking during reflow soldering is an important problem for the reliability of plastic encapsulated semiconductor devices. This paper describes a simplified method of package cracking estimation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture constant. The consequent process of package expansion during reflow soldering was measured. The individual processes were fitted by calculation and provided a precise mechanism of package cracking.

Original languageEnglish
Title of host publicationIEEE/CHMT European International Electronic Manufacturing Technology Symposium
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages295-298
Number of pages4
ISBN (Print)0780314328
Publication statusPublished - 1993
EventProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium - Kanazawa, Jpn
Duration: 1993 Jun 91993 Jun 11

Other

OtherProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium
CityKanazawa, Jpn
Period93/6/993/6/11

Fingerprint

Soldering
Plastics
Semiconductor devices
Materials properties
Atmospheric humidity
Moisture
Resins

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Sawada, K., Nakazawa, T., Kawamura, N., & Sudo, T. (1993). Package deformation and cracking mechanism due to reflow soldering. In IEEE/CHMT European International Electronic Manufacturing Technology Symposium (pp. 295-298). Piscataway, NJ, United States: Publ by IEEE.

Package deformation and cracking mechanism due to reflow soldering. / Sawada, Kanako; Nakazawa, Tsutomu; Kawamura, Noriyasu; Sudo, Toshio.

IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Piscataway, NJ, United States : Publ by IEEE, 1993. p. 295-298.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sawada, K, Nakazawa, T, Kawamura, N & Sudo, T 1993, Package deformation and cracking mechanism due to reflow soldering. in IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Publ by IEEE, Piscataway, NJ, United States, pp. 295-298, Proceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium, Kanazawa, Jpn, 93/6/9.
Sawada K, Nakazawa T, Kawamura N, Sudo T. Package deformation and cracking mechanism due to reflow soldering. In IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Piscataway, NJ, United States: Publ by IEEE. 1993. p. 295-298
Sawada, Kanako ; Nakazawa, Tsutomu ; Kawamura, Noriyasu ; Sudo, Toshio. / Package deformation and cracking mechanism due to reflow soldering. IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Piscataway, NJ, United States : Publ by IEEE, 1993. pp. 295-298
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