Package deformation and cracking mechanism due to reflow soldering

Kanako Sawada, Tsutomu Nakazawa, Noriyasu Kawamura, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

Plastic package cracking during reflow soldering is an important problem for the reliability of plastic encapsulated semiconductor devices. This paper describes a simplified method of package cracking estimation obtained by introducing a material property for resin A which is the coefficient between the relative humidity of storage and the saturated moisture constant. The consequent process of package expansion during reflow soldering was measured. The individual processes were fitted by calculation and provided a precise mechanism of package cracking.

Original languageEnglish
Title of host publicationIEEE/CHMT European International Electronic Manufacturing Technology Symposium
PublisherPubl by IEEE
Pages295-298
Number of pages4
ISBN (Print)0780314328
Publication statusPublished - 1993 Dec 1
EventProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium - Kanazawa, Jpn
Duration: 1993 Jun 91993 Jun 11

Publication series

NameIEEE/CHMT European International Electronic Manufacturing Technology Symposium

Other

OtherProceedings of the 14th IEEE/CHMT Japan International Electronics Manufacturing Technology (IEMT) Symposium
CityKanazawa, Jpn
Period93/6/993/6/11

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Sawada, K., Nakazawa, T., Kawamura, N., & Sudo, T. (1993). Package deformation and cracking mechanism due to reflow soldering. In IEEE/CHMT European International Electronic Manufacturing Technology Symposium (pp. 295-298). (IEEE/CHMT European International Electronic Manufacturing Technology Symposium). Publ by IEEE.