Packaging of a thin-film sensor for transepidermal water loss measurements

M. Mündlein, J. Nicolics, R. Chabicovsky, P. Svasek, E. Svasek, T. Komeda, H. Funakubo, T. Nagashima, M. Ito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The water content in the superficial part of the human skin is one index to evaluate the skin health. In the past we have developed a packaging concept which brings a sensor chip carrying a comb-shaped electrode system into intimate contact with the skin. The electrical impedance between these electrodes can be used as a measure for the water content of the skin. However, we have recently found that the same sensor chip used with a slightly altered packaging concept can measure the transepidermal water loss (TEWL), which is another indicator for the skin health. In our paper we report on the interconnection and packaging technique of this advanced measuring system for the evaluation of human skin. Furthermore, we present some first measurement results. The basic structure of the sensor consists of a thin film interdigital electrode system deposited on a ceramic substrate by rf-sputtering. Thin wires are guided through funnel-shaped holes arranged in the center of the contact pads. A CO2 laser with a wavelength in the medium infrared range is used to produce these holes. The wires are bonded to the contact metallizations by using conductive adhesives. In the case of TEWL measurements the sensor chip does not touch the skin. The chip is placed in a distance of a few millimeters away from the skin. The electrical impedance of the electrode system depends on the stream of water molecules emitted from the skin. This kind of measurement does not suffer from pollution of the sensor chip by the oily substances of the skin surface. Therefore, the results are more reproducible compared to classical skin impedance measurements.

Original languageEnglish
Title of host publication26th International Spring Seminar on Electronics Technology
Subtitle of host publicationIntegrated Management of Electronic Materials Production, ISSE 2003 - Conference Proceedings
EditorsAlena Pietrikova, Jan Urbancik
PublisherIEEE Computer Society
Pages328-333
Number of pages6
ISBN (Electronic)0780380029
DOIs
Publication statusPublished - 2003 Jan 1
Event26th International Spring Seminar on Electronics Technology, ISSE 2003 - High Tatras, Slovakia
Duration: 2003 May 82003 May 11

Publication series

NameProceedings of the International Spring Seminar on Electronics Technology
Volume2003-January
ISSN (Print)2161-2528
ISSN (Electronic)2161-2536

Other

Other26th International Spring Seminar on Electronics Technology, ISSE 2003
CountrySlovakia
CityHigh Tatras
Period03/5/803/5/11

Keywords

  • Contacts
  • Electrodes
  • Humans
  • Loss measurement
  • Packaging
  • Pollution measurement
  • Semiconductor device measurement
  • Sensor systems
  • Skin
  • Thin film sensors

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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