Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe, Hitoshi Oka, Shusaku Izumi, Yukihiro Taniguchi, Shigeru Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

Original languageEnglish
Title of host publicationProceedings - Electronic Components Conference
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages1053-1059
Number of pages7
ISBN (Print)0818626607
Publication statusPublished - 1992 Jan
Externally publishedYes
EventProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
Duration: 1992 May 181992 May 20

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period92/5/1892/5/20

Fingerprint

Copper plating
Printed circuit boards
Electroless plating
Switching systems
Alkalinity
Soldering alloys
Electric properties
Copper
Mechanical properties
Networks (circuits)
Chemical analysis
Costs
Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Imabayashi, S., Tanaka, I., Kikuchi, H., Watanabe, M., Oka, H., Izumi, S., ... Fujita, S. (1992). Partly-additive process for manufacturing high-density printed wiring boards. In Proceedings - Electronic Components Conference (pp. 1053-1059). Piscataway, NJ, United States: Publ by IEEE.

Partly-additive process for manufacturing high-density printed wiring boards. / Imabayashi, Shinichiro; Tanaka, Isamu; Kikuchi, Hiroshi; Watanabe, Makio; Oka, Hitoshi; Izumi, Shusaku; Taniguchi, Yukihiro; Fujita, Shigeru.

Proceedings - Electronic Components Conference. Piscataway, NJ, United States : Publ by IEEE, 1992. p. 1053-1059.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Imabayashi, S, Tanaka, I, Kikuchi, H, Watanabe, M, Oka, H, Izumi, S, Taniguchi, Y & Fujita, S 1992, Partly-additive process for manufacturing high-density printed wiring boards. in Proceedings - Electronic Components Conference. Publ by IEEE, Piscataway, NJ, United States, pp. 1053-1059, Proceedings of the 42nd Electronic Components and Technology Conference, San Diego, CA, USA, 92/5/18.
Imabayashi S, Tanaka I, Kikuchi H, Watanabe M, Oka H, Izumi S et al. Partly-additive process for manufacturing high-density printed wiring boards. In Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE. 1992. p. 1053-1059
Imabayashi, Shinichiro ; Tanaka, Isamu ; Kikuchi, Hiroshi ; Watanabe, Makio ; Oka, Hitoshi ; Izumi, Shusaku ; Taniguchi, Yukihiro ; Fujita, Shigeru. / Partly-additive process for manufacturing high-density printed wiring boards. Proceedings - Electronic Components Conference. Piscataway, NJ, United States : Publ by IEEE, 1992. pp. 1053-1059
@inproceedings{8800bf2327d04f21adaf053f5d63cc2d,
title = "Partly-additive process for manufacturing high-density printed wiring boards",
abstract = "A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.",
author = "Shinichiro Imabayashi and Isamu Tanaka and Hiroshi Kikuchi and Makio Watanabe and Hitoshi Oka and Shusaku Izumi and Yukihiro Taniguchi and Shigeru Fujita",
year = "1992",
month = "1",
language = "English",
isbn = "0818626607",
pages = "1053--1059",
booktitle = "Proceedings - Electronic Components Conference",
publisher = "Publ by IEEE",

}

TY - GEN

T1 - Partly-additive process for manufacturing high-density printed wiring boards

AU - Imabayashi, Shinichiro

AU - Tanaka, Isamu

AU - Kikuchi, Hiroshi

AU - Watanabe, Makio

AU - Oka, Hitoshi

AU - Izumi, Shusaku

AU - Taniguchi, Yukihiro

AU - Fujita, Shigeru

PY - 1992/1

Y1 - 1992/1

N2 - A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

AB - A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

UR - http://www.scopus.com/inward/record.url?scp=0026618460&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0026618460&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0818626607

SP - 1053

EP - 1059

BT - Proceedings - Electronic Components Conference

PB - Publ by IEEE

CY - Piscataway, NJ, United States

ER -