Partly-additive process for manufacturing high-density printed wiring boards

Shinichiro Imabayashi, Isamu Tanaka, Hiroshi Kikuchi, Makio Watanabe, Hitoshi Oka, Shusaku Izumi, Yukihiro Taniguchi, Shigeru Fujita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A highly reliable, high-density printed wiring board process called the partly additive process has been developed for manufacturing high-speed digital switching systems. The partly additive process realizes very fine, highly reliable through-holes and circuit patterns at fairly low cost. To realize this process, a specially designed solder-resist that can withstand high temperatures and the high alkalinity of electroless copper plating solution was developed. A new electroless copper plating solution was also developed that can deposite copper having excellent mechanical and electrical properties. The composition of the electroless copper plating solution could be tightly controlled using a newly developed system to automatically monitor and supply solution components accurately.

Original languageEnglish
Title of host publicationProceedings - Electronic Components Conference
PublisherPubl by IEEE
Pages1053-1059
Number of pages7
ISBN (Print)0818626607
Publication statusPublished - 1992 Jan 1
EventProceedings of the 42nd Electronic Components and Technology Conference - San Diego, CA, USA
Duration: 1992 May 181992 May 20

Publication series

NameProceedings - Electronic Components Conference
ISSN (Print)0569-5503

Other

OtherProceedings of the 42nd Electronic Components and Technology Conference
CitySan Diego, CA, USA
Period92/5/1892/5/20

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Imabayashi, S., Tanaka, I., Kikuchi, H., Watanabe, M., Oka, H., Izumi, S., Taniguchi, Y., & Fujita, S. (1992). Partly-additive process for manufacturing high-density printed wiring boards. In Proceedings - Electronic Components Conference (pp. 1053-1059). (Proceedings - Electronic Components Conference). Publ by IEEE.