PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

T.Sudo T.Sudo, Y.Oizono Y.Oizono, Y.Nabeshima Y.Nabeshima, T.Okumura T.Okumura, A.Sakai A.Sakai, S.Uchiyam S.Uchiyam, H.Ikeda H.Ikeda, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalProceedings of IEEE 3DIC 2011
Publication statusPublished - 2012 Feb 2

Cite this

T.Sudo, T. S., Y.Oizono, Y. O., Y.Nabeshima, Y. N., T.Okumura, T. O., A.Sakai, A. S., S.Uchiyam, S. U., ... Sudo, T. (2012). PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. Proceedings of IEEE 3DIC 2011.

PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. / T.Sudo, T.Sudo; Y.Oizono, Y.Oizono; Y.Nabeshima, Y.Nabeshima; T.Okumura, T.Okumura; A.Sakai, A.Sakai; S.Uchiyam, S.Uchiyam; H.Ikeda, H.Ikeda; Sudo, Toshio.

In: Proceedings of IEEE 3DIC 2011, 02.02.2012.

Research output: Contribution to journalArticle

T.Sudo, TS, Y.Oizono, YO, Y.Nabeshima, YN, T.Okumura, TO, A.Sakai, AS, S.Uchiyam, SU, H.Ikeda, HI & Sudo, T 2012, 'PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure', Proceedings of IEEE 3DIC 2011.
T.Sudo TS, Y.Oizono YO, Y.Nabeshima YN, T.Okumura TO, A.Sakai AS, S.Uchiyam SU et al. PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. Proceedings of IEEE 3DIC 2011. 2012 Feb 2.
T.Sudo, T.Sudo ; Y.Oizono, Y.Oizono ; Y.Nabeshima, Y.Nabeshima ; T.Okumura, T.Okumura ; A.Sakai, A.Sakai ; S.Uchiyam, S.Uchiyam ; H.Ikeda, H.Ikeda ; Sudo, Toshio. / PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. In: Proceedings of IEEE 3DIC 2011. 2012.
@article{8b4891e5d5b645cfb7d68fe80f1b1ddf,
title = "PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure",
author = "T.Sudo T.Sudo and Y.Oizono Y.Oizono and Y.Nabeshima Y.Nabeshima and T.Okumura T.Okumura and A.Sakai A.Sakai and S.Uchiyam S.Uchiyam and H.Ikeda H.Ikeda and Toshio Sudo",
year = "2012",
month = "2",
day = "2",
language = "English",
journal = "Proceedings of IEEE 3DIC 2011",

}

TY - JOUR

T1 - PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

AU - T.Sudo, T.Sudo

AU - Y.Oizono, Y.Oizono

AU - Y.Nabeshima, Y.Nabeshima

AU - T.Okumura, T.Okumura

AU - A.Sakai, A.Sakai

AU - S.Uchiyam, S.Uchiyam

AU - H.Ikeda, H.Ikeda

AU - Sudo, Toshio

PY - 2012/2/2

Y1 - 2012/2/2

M3 - Article

JO - Proceedings of IEEE 3DIC 2011

JF - Proceedings of IEEE 3DIC 2011

ER -