PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

T.Sudo T.Sudo, Y.Oizono Y.Oizono, Y.Nabeshima Y.Nabeshima, T.Okumura T.Okumura, A.Sakai A.Sakai, S.Uchiyam S.Uchiyam, H.Ikeda H.Ikeda, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalProceedings of IEEE 3DIC 2011
Publication statusPublished - 2012 Feb 2

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T.Sudo, T. S., Y.Oizono, Y. O., Y.Nabeshima, Y. N., T.Okumura, T. O., A.Sakai, A. S., S.Uchiyam, S. U., H.Ikeda, H. I., & Sudo, T. (2012). PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure. Proceedings of IEEE 3DIC 2011.