PDN impedance and SSO noise simulation of 3D system-in-package with a widebus structure

Yoshiaki Oizono, Yoshitaka Nabeshima, Takafumi Okumura, Toshio Sudo, Atsushi Sakai, Shiro Uchiyama, Hiroaki Ikeda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Engineering & Materials Science