Engineering & Materials Science
Photoresists
76%
Gas mixtures
68%
Ammonia
64%
Plasmas
55%
Carbon
45%
Hydrogen
36%
Contact resistance
34%
Gases
34%
Etching
32%
Flow of gases
29%
Flow rate
22%
Fluorine
20%
Amorphous silicon
20%
Reaction products
19%
Thin film transistors
19%
Argon
17%
Liquid crystal displays
16%
Atoms
15%
Oxygen
12%
Fabrication
11%
Temperature
6%
Physics & Astronomy
carbon tetrafluoride
100%
photoresists
63%
ammonia
61%
gas mixtures
57%
contact resistance
31%
gases
31%
gas flow
27%
flow velocity
24%
etching
22%
damage
21%
reaction products
16%
fluorine
15%
amorphous silicon
13%
transistors
12%
liquid crystals
11%
argon
11%
hydrogen
9%
fabrication
9%
oxygen
9%
room temperature
8%
thin films
7%
atoms
7%