Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices

Salinee Choowitsakunlert; Kenji Takagiwa; Takuya Kobashigawa; Nariaki Hosoya; Rardchawadee Silapunt; Hideki Yokoi

doi:10.7567/JJAP.57.058007

Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices

Salinee Choowitsakunlert, Kenji Takagiwa, Takuya Kobashigawa, Nariaki Hosoya, Rardchawadee Silapunt, Hideki Yokoi

Research output: Contribution to journal › Article

Abstract

A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.

Original language	English
Article number	058007
Journal	Japanese Journal of Applied Physics
Volume	57
Issue number	5
DOIs	https://doi.org/10.7567/JJAP.57.058007
Publication status	Published - 2018 May 1

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ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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Choowitsakunlert, S., Takagiwa, K., Kobashigawa, T., Hosoya, N., Silapunt, R., & Yokoi, H. (2018). Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices. Japanese Journal of Applied Physics, 57(5), [058007]. https://doi.org/10.7567/JJAP.57.058007

Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices. / Choowitsakunlert, Salinee; Takagiwa, Kenji; Kobashigawa, Takuya; Hosoya, Nariaki; Silapunt, Rardchawadee; Yokoi, Hideki.

In: Japanese Journal of Applied Physics, Vol. 57, No. 5, 058007, 01.05.2018.

Research output: Contribution to journal › Article

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10.7567/JJAP.57.058007