Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices

Salinee Choowitsakunlert, Kenji Takagiwa, Takuya Kobashigawa, Nariaki Hosoya, Rardchawadee Silapunt, Hideki Yokoi

Research output: Contribution to journalArticle

Abstract

A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.

Original languageEnglish
Article number058007
JournalJapanese Journal of Applied Physics
Volume57
Issue number5
DOIs
Publication statusPublished - 2018 May 1

Fingerprint

adhesive bonding
Magnetooptical effects
Optical devices
Adhesives
Waveguides
waveguides
adhesives
Dilution
dilution
isolators
Garnets
garnets
insulators
Radiation
Fabrication
Silicon
fabrication
silicon
Substrates
radiation

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices. / Choowitsakunlert, Salinee; Takagiwa, Kenji; Kobashigawa, Takuya; Hosoya, Nariaki; Silapunt, Rardchawadee; Yokoi, Hideki.

In: Japanese Journal of Applied Physics, Vol. 57, No. 5, 058007, 01.05.2018.

Research output: Contribution to journalArticle

Choowitsakunlert, Salinee ; Takagiwa, Kenji ; Kobashigawa, Takuya ; Hosoya, Nariaki ; Silapunt, Rardchawadee ; Yokoi, Hideki. / Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices. In: Japanese Journal of Applied Physics. 2018 ; Vol. 57, No. 5.
@article{08e424a43cdf4c66803f4efdfe91a79d,
title = "Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices",
abstract = "A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2{\%}.",
author = "Salinee Choowitsakunlert and Kenji Takagiwa and Takuya Kobashigawa and Nariaki Hosoya and Rardchawadee Silapunt and Hideki Yokoi",
year = "2018",
month = "5",
day = "1",
doi = "10.7567/JJAP.57.058007",
language = "English",
volume = "57",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "5",

}

TY - JOUR

T1 - Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices

AU - Choowitsakunlert, Salinee

AU - Takagiwa, Kenji

AU - Kobashigawa, Takuya

AU - Hosoya, Nariaki

AU - Silapunt, Rardchawadee

AU - Yokoi, Hideki

PY - 2018/5/1

Y1 - 2018/5/1

N2 - A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.

AB - A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.

UR - http://www.scopus.com/inward/record.url?scp=85046545536&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85046545536&partnerID=8YFLogxK

U2 - 10.7567/JJAP.57.058007

DO - 10.7567/JJAP.57.058007

M3 - Article

VL - 57

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 5

M1 - 058007

ER -