Abstract
A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.
| Original language | English |
|---|---|
| Article number | 058007 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 57 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2018 May 1 |
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ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)
Cite this
Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices. / Choowitsakunlert, Salinee; Takagiwa, Kenji; Kobashigawa, Takuya; Hosoya, Nariaki; Silapunt, Rardchawadee; Yokoi, Hideki.
In: Japanese Journal of Applied Physics, Vol. 57, No. 5, 058007, 01.05.2018.Research output: Contribution to journal › Article
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TY - JOUR
T1 - Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices
AU - Choowitsakunlert, Salinee
AU - Takagiwa, Kenji
AU - Kobashigawa, Takuya
AU - Hosoya, Nariaki
AU - Silapunt, Rardchawadee
AU - Yokoi, Hideki
PY - 2018/5/1
Y1 - 2018/5/1
N2 - A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.
AB - A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 µm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 µm at a dilution ratio of 2%.
UR - http://www.scopus.com/inward/record.url?scp=85046545536&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85046545536&partnerID=8YFLogxK
U2 - 10.7567/JJAP.57.058007
DO - 10.7567/JJAP.57.058007
M3 - Article
AN - SCOPUS:85046545536
VL - 57
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 5
M1 - 058007
ER -