Plasma-cavitation pencil cutter for powerful micro-processing

Y. Arakawa, M. Ohmura, D. Tsujimoto, Y. Yamanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have successfully developed novel processing equipment based on the combined of cavitation and plasma irradiation. This technique uses the strong points of the powerful ablation of cavitation as well as plasma irradiation. The novelty of the technique enable to process not only conductive material but also non-conductive material such as polymer, CFRP (carbon fiber reinforced plastic) and silicon, which is unlike conventional wire electric discharge machine. Also, the directional transportation of bubbles provides positioning accuracy of micro-processing. The structure of the plasma-cavitation pencil cutter is low cost and very simple structure. This technology contributes to effective processing of wide range of materials such as metal plate, polymer, carbon-fiber and biomaterials.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages521-524
Number of pages4
ISBN (Print)9781479989553
DOIs
Publication statusPublished - 2015 Aug 5
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: 2015 Jun 212015 Jun 25

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period15/6/2115/6/25

Fingerprint

cutters
cavitation flow
Cavitation
Plasmas
Processing
Irradiation
Conductive materials
Electric discharges
carbon fiber reinforced plastics
Plate metal
metal plates
irradiation
electric discharges
Carbon fiber reinforced plastics
polymers
Polymers
Ablation
carbon fibers
Biomaterials
ablation

Keywords

  • Ablation
  • Cavitation
  • Plasma
  • Processing

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Arakawa, Y., Ohmura, M., Tsujimoto, D., & Yamanishi, Y. (2015). Plasma-cavitation pencil cutter for powerful micro-processing. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 (pp. 521-524). [7180975] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2015.7180975

Plasma-cavitation pencil cutter for powerful micro-processing. / Arakawa, Y.; Ohmura, M.; Tsujimoto, D.; Yamanishi, Y.

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 521-524 7180975.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Arakawa, Y, Ohmura, M, Tsujimoto, D & Yamanishi, Y 2015, Plasma-cavitation pencil cutter for powerful micro-processing. in 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015., 7180975, Institute of Electrical and Electronics Engineers Inc., pp. 521-524, 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, Anchorage, United States, 15/6/21. https://doi.org/10.1109/TRANSDUCERS.2015.7180975
Arakawa Y, Ohmura M, Tsujimoto D, Yamanishi Y. Plasma-cavitation pencil cutter for powerful micro-processing. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 521-524. 7180975 https://doi.org/10.1109/TRANSDUCERS.2015.7180975
Arakawa, Y. ; Ohmura, M. ; Tsujimoto, D. ; Yamanishi, Y. / Plasma-cavitation pencil cutter for powerful micro-processing. 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 521-524
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