Plasma nitriding design for aluminium and aluminium alloys

P. Visuttipitukul, T. Aizawa

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Plasma nitriding for aluminium and aluminium alloys is a promising processing to improve the wear resistance for automotive parts. Normal plasma nitriding is characterised by three processes: presputtering, aluminium nitride nucleation and nitrided layer growth processes. N2+ presputtering is used to effectively eliminate the preexisting oxide films of Al2O3, covering the surface of aluminium matrix. Relatively long incubation time is required for nucleation process to form AlN islands or nodules on its surface. In addition, formation rate becomes very slow owing to low nitrogen diffusion coefficient in the nitrided layer. Physical and chemical modification methods to this normal nitriding processing are proposed to accelerate the formation rate of nitrided layer. Refinement of grain size in the aluminium matrix increases the formation rate by enlarging grain boundary area as a diffusion path. Crystallographic coherency between TiN and AlN reflects on enhancement of nucleation process by coformation of TiN with AlN. Standing on the nitriding design by physical and chemical modification of inner nitriding mechanism, an alternative plasma nitriding is proposed as the third processing for copper bearing aluminium alloys. In this processing, reduction of duration for nucleation and acceleration of growth rate are attained with the aid of the precipitate, Al2Cu. Crystallographic coherency between AlN and Al2Cu is effective to enhance the formation of AlN nodules and islands. Solid state reaction between Al2Cu and penetrating nitrogen is also significant to form the fine interfacial boundaries as a nitrogen diffusion path and to accelerate the formation rate of nitrided layer.

Original languageEnglish
Pages (from-to)187-195
Number of pages9
JournalSurface Engineering
Volume22
Issue number3
DOIs
Publication statusPublished - 2006 Jun
Externally publishedYes

Fingerprint

nitriding
Nitriding
Aluminum
aluminum alloys
Aluminum alloys
aluminum
Plasmas
Nucleation
nucleation
Nitrogen
nodules
Chemical modification
Processing
nitrogen
Bearings (structural)
bearing alloys
Aluminum nitride
aluminum nitrides
matrices
Solid state reactions

Keywords

  • Accelerated formation rate
  • Acceleration of nitriding
  • Aluminium alloys
  • Aluminium nitride
  • CUA12
  • Grain size refinement
  • Micro-alloying
  • Nitrogen diffusion coefficient
  • Plasma nitriding
  • Precipitate accompdation

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Plasma nitriding design for aluminium and aluminium alloys. / Visuttipitukul, P.; Aizawa, T.

In: Surface Engineering, Vol. 22, No. 3, 06.2006, p. 187-195.

Research output: Contribution to journalArticle

Visuttipitukul, P. ; Aizawa, T. / Plasma nitriding design for aluminium and aluminium alloys. In: Surface Engineering. 2006 ; Vol. 22, No. 3. pp. 187-195.
@article{96ef2a060937426383017342e13c81ec,
title = "Plasma nitriding design for aluminium and aluminium alloys",
abstract = "Plasma nitriding for aluminium and aluminium alloys is a promising processing to improve the wear resistance for automotive parts. Normal plasma nitriding is characterised by three processes: presputtering, aluminium nitride nucleation and nitrided layer growth processes. N2+ presputtering is used to effectively eliminate the preexisting oxide films of Al2O3, covering the surface of aluminium matrix. Relatively long incubation time is required for nucleation process to form AlN islands or nodules on its surface. In addition, formation rate becomes very slow owing to low nitrogen diffusion coefficient in the nitrided layer. Physical and chemical modification methods to this normal nitriding processing are proposed to accelerate the formation rate of nitrided layer. Refinement of grain size in the aluminium matrix increases the formation rate by enlarging grain boundary area as a diffusion path. Crystallographic coherency between TiN and AlN reflects on enhancement of nucleation process by coformation of TiN with AlN. Standing on the nitriding design by physical and chemical modification of inner nitriding mechanism, an alternative plasma nitriding is proposed as the third processing for copper bearing aluminium alloys. In this processing, reduction of duration for nucleation and acceleration of growth rate are attained with the aid of the precipitate, Al2Cu. Crystallographic coherency between AlN and Al2Cu is effective to enhance the formation of AlN nodules and islands. Solid state reaction between Al2Cu and penetrating nitrogen is also significant to form the fine interfacial boundaries as a nitrogen diffusion path and to accelerate the formation rate of nitrided layer.",
keywords = "Accelerated formation rate, Acceleration of nitriding, Aluminium alloys, Aluminium nitride, CUA12, Grain size refinement, Micro-alloying, Nitrogen diffusion coefficient, Plasma nitriding, Precipitate accompdation",
author = "P. Visuttipitukul and T. Aizawa",
year = "2006",
month = "6",
doi = "10.1179/174329406X108898",
language = "English",
volume = "22",
pages = "187--195",
journal = "Surface Engineering",
issn = "0267-0844",
publisher = "Maney Publishing",
number = "3",

}

TY - JOUR

T1 - Plasma nitriding design for aluminium and aluminium alloys

AU - Visuttipitukul, P.

AU - Aizawa, T.

PY - 2006/6

Y1 - 2006/6

N2 - Plasma nitriding for aluminium and aluminium alloys is a promising processing to improve the wear resistance for automotive parts. Normal plasma nitriding is characterised by three processes: presputtering, aluminium nitride nucleation and nitrided layer growth processes. N2+ presputtering is used to effectively eliminate the preexisting oxide films of Al2O3, covering the surface of aluminium matrix. Relatively long incubation time is required for nucleation process to form AlN islands or nodules on its surface. In addition, formation rate becomes very slow owing to low nitrogen diffusion coefficient in the nitrided layer. Physical and chemical modification methods to this normal nitriding processing are proposed to accelerate the formation rate of nitrided layer. Refinement of grain size in the aluminium matrix increases the formation rate by enlarging grain boundary area as a diffusion path. Crystallographic coherency between TiN and AlN reflects on enhancement of nucleation process by coformation of TiN with AlN. Standing on the nitriding design by physical and chemical modification of inner nitriding mechanism, an alternative plasma nitriding is proposed as the third processing for copper bearing aluminium alloys. In this processing, reduction of duration for nucleation and acceleration of growth rate are attained with the aid of the precipitate, Al2Cu. Crystallographic coherency between AlN and Al2Cu is effective to enhance the formation of AlN nodules and islands. Solid state reaction between Al2Cu and penetrating nitrogen is also significant to form the fine interfacial boundaries as a nitrogen diffusion path and to accelerate the formation rate of nitrided layer.

AB - Plasma nitriding for aluminium and aluminium alloys is a promising processing to improve the wear resistance for automotive parts. Normal plasma nitriding is characterised by three processes: presputtering, aluminium nitride nucleation and nitrided layer growth processes. N2+ presputtering is used to effectively eliminate the preexisting oxide films of Al2O3, covering the surface of aluminium matrix. Relatively long incubation time is required for nucleation process to form AlN islands or nodules on its surface. In addition, formation rate becomes very slow owing to low nitrogen diffusion coefficient in the nitrided layer. Physical and chemical modification methods to this normal nitriding processing are proposed to accelerate the formation rate of nitrided layer. Refinement of grain size in the aluminium matrix increases the formation rate by enlarging grain boundary area as a diffusion path. Crystallographic coherency between TiN and AlN reflects on enhancement of nucleation process by coformation of TiN with AlN. Standing on the nitriding design by physical and chemical modification of inner nitriding mechanism, an alternative plasma nitriding is proposed as the third processing for copper bearing aluminium alloys. In this processing, reduction of duration for nucleation and acceleration of growth rate are attained with the aid of the precipitate, Al2Cu. Crystallographic coherency between AlN and Al2Cu is effective to enhance the formation of AlN nodules and islands. Solid state reaction between Al2Cu and penetrating nitrogen is also significant to form the fine interfacial boundaries as a nitrogen diffusion path and to accelerate the formation rate of nitrided layer.

KW - Accelerated formation rate

KW - Acceleration of nitriding

KW - Aluminium alloys

KW - Aluminium nitride

KW - CUA12

KW - Grain size refinement

KW - Micro-alloying

KW - Nitrogen diffusion coefficient

KW - Plasma nitriding

KW - Precipitate accompdation

UR - http://www.scopus.com/inward/record.url?scp=33747126141&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33747126141&partnerID=8YFLogxK

U2 - 10.1179/174329406X108898

DO - 10.1179/174329406X108898

M3 - Article

AN - SCOPUS:33747126141

VL - 22

SP - 187

EP - 195

JO - Surface Engineering

JF - Surface Engineering

SN - 0267-0844

IS - 3

ER -