Polyimide Substrate for High Speed GaAs Hybrid Modules

T.Sudo T.Sudo, K.Yoshihara K.Yoshihara, T.Saito T.Saito, K.Jiro K.Jiro, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)33-33
Journal5th VLSI Packaging Workshop, Paris
Publication statusPublished - 1986 Oct 30

Cite this

T.Sudo, T. S., K.Yoshihara, K. Y., T.Saito, T. S., K.Jiro, K. J., & Sudo, T. (1986). Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris, 33-33.