| Original language | English |
|---|---|
| Pages (from-to) | 33-33 |
| Journal | 5th VLSI Packaging Workshop, Paris |
| Publication status | Published - 1986 Oct 30 |
Cite this
T.Sudo, T. S., K.Yoshihara, K. Y., T.Saito, T. S., K.Jiro, K. J., & Sudo, T. (1986). Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris, 33-33.
Polyimide Substrate for High Speed GaAs Hybrid Modules. / T.Sudo, T.Sudo; K.Yoshihara, K.Yoshihara; T.Saito, T.Saito; K.Jiro, K.Jiro; Sudo, Toshio.
In: 5th VLSI Packaging Workshop, Paris, 30.10.1986, p. 33-33.Research output: Contribution to journal › Article
T.Sudo, TS, K.Yoshihara, KY, T.Saito, TS, K.Jiro, KJ & Sudo, T 1986, 'Polyimide Substrate for High Speed GaAs Hybrid Modules', 5th VLSI Packaging Workshop, Paris, pp. 33-33.
T.Sudo TS, K.Yoshihara KY, T.Saito TS, K.Jiro KJ, Sudo T. Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris. 1986 Oct 30;33-33.
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title = "Polyimide Substrate for High Speed GaAs Hybrid Modules",
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AU - K.Jiro, K.Jiro
AU - Sudo, Toshio
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