Original language | English |
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Pages (from-to) | 33-33 |
Journal | 5th VLSI Packaging Workshop, Paris |
Publication status | Published - 1986 Oct 30 |
Polyimide Substrate for High Speed GaAs Hybrid Modules
T.Sudo T.Sudo, K.Yoshihara K.Yoshihara, T.Saito T.Saito, K.Jiro K.Jiro, Toshio Sudo
Research output: Contribution to journal › Article › peer-review