Polyimide Substrate for High Speed GaAs Hybrid Modules

T.Sudo T.Sudo, K.Yoshihara K.Yoshihara, T.Saito T.Saito, K.Jiro K.Jiro, Toshio Sudo

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	33-33
Journal	5th VLSI Packaging Workshop, Paris
Publication status	Published - 1986 Oct 30

Cite this

T.Sudo, T. S., K.Yoshihara, K. Y., T.Saito, T. S., K.Jiro, K. J., & Sudo, T. (1986). Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris, 33-33.

@article{9b1d6a13f2f94410aa3d885925d1119c,

title = "Polyimide Substrate for High Speed GaAs Hybrid Modules",

author = "T.Sudo T.Sudo and K.Yoshihara K.Yoshihara and T.Saito T.Saito and K.Jiro K.Jiro and Toshio Sudo",

year = "1986",

month = oct,

day = "30",

language = "English",

pages = "33--33",

journal = "5th VLSI Packaging Workshop, Paris",

}