Polyimide Substrate for High Speed GaAs Hybrid Modules

T.Sudo T.Sudo, K.Yoshihara K.Yoshihara, T.Saito T.Saito, K.Jiro K.Jiro, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)33-33
Journal5th VLSI Packaging Workshop, Paris
Publication statusPublished - 1986 Oct 30

Cite this

T.Sudo, T. S., K.Yoshihara, K. Y., T.Saito, T. S., K.Jiro, K. J., & Sudo, T. (1986). Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris, 33-33.

Polyimide Substrate for High Speed GaAs Hybrid Modules. / T.Sudo, T.Sudo; K.Yoshihara, K.Yoshihara; T.Saito, T.Saito; K.Jiro, K.Jiro; Sudo, Toshio.

In: 5th VLSI Packaging Workshop, Paris, 30.10.1986, p. 33-33.

Research output: Contribution to journalArticle

T.Sudo, TS, K.Yoshihara, KY, T.Saito, TS, K.Jiro, KJ & Sudo, T 1986, 'Polyimide Substrate for High Speed GaAs Hybrid Modules', 5th VLSI Packaging Workshop, Paris, pp. 33-33.
T.Sudo TS, K.Yoshihara KY, T.Saito TS, K.Jiro KJ, Sudo T. Polyimide Substrate for High Speed GaAs Hybrid Modules. 5th VLSI Packaging Workshop, Paris. 1986 Oct 30;33-33.
T.Sudo, T.Sudo ; K.Yoshihara, K.Yoshihara ; T.Saito, T.Saito ; K.Jiro, K.Jiro ; Sudo, Toshio. / Polyimide Substrate for High Speed GaAs Hybrid Modules. In: 5th VLSI Packaging Workshop, Paris. 1986 ; pp. 33-33.
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