Polyimide Substrate for High Speed GaAs Hybrid Modules

T.Sudo T.Sudo, K.Yoshihara K.Yoshihara, T.Saito T.Saito, K.Jiro K.Jiro, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)33-33
Journal5th VLSI Packaging Workshop, Paris
Publication statusPublished - 1986 Oct 30

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