Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”

K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, M.Mukai M.Mukai, Toshio Sudo

Research output: Contribution to journal › Article

K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S., M.Mukai, M. M., & Sudo, T. (1995). Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. ISHM'95, 247-252.

@article{dc584edb129249bb9d536644f3652d4e,

title = "Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”",

author = "K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and M.Mukai M.Mukai and Toshio Sudo",

year = "1995",

month = "11",

day = "15",

language = "English",

pages = "247--252",

journal = "ISHM'95",

}