Original language | English |
---|---|
Pages (from-to) | 247-252 |
Journal | ISHM'95 |
Publication status | Published - 1995 Nov 15 |
Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”
K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, M.Mukai M.Mukai, Toshio Sudo
Research output: Contribution to journal › Article › peer-review