Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”

K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, M.Mukai M.Mukai, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)247-252
JournalISHM'95
Publication statusPublished - 1995 Nov 15

Cite this

K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S., M.Mukai, M. M., & Sudo, T. (1995). Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. ISHM'95, 247-252.

Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. / K.Doi, K.Doi; N.Hirano, N.Hirano; T.Okada, T.Okada; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; M.Mukai, M.Mukai; Sudo, Toshio.

In: ISHM'95, 15.11.1995, p. 247-252.

Research output: Contribution to journalArticle

K.Doi, KD, N.Hirano, NH, T.Okada, TO, Y.Hiruta, YH, T.Sudo, TS, M.Mukai, MM & Sudo, T 1995, 'Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”', ISHM'95, pp. 247-252.
K.Doi KD, N.Hirano NH, T.Okada TO, Y.Hiruta YH, T.Sudo TS, M.Mukai MM et al. Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. ISHM'95. 1995 Nov 15;247-252.
K.Doi, K.Doi ; N.Hirano, N.Hirano ; T.Okada, T.Okada ; Y.Hiruta, Y.Hiruta ; T.Sudo, T.Sudo ; M.Mukai, M.Mukai ; Sudo, Toshio. / Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. In: ISHM'95. 1995 ; pp. 247-252.
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