Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”

K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, M.Mukai M.Mukai, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)247-252
JournalISHM'95
Publication statusPublished - 1995 Nov 15

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