Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”

K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, M.Mukai M.Mukai, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)247-252
JournalISHM'95
Publication statusPublished - 1995 Nov 15

Cite this

K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., Y.Hiruta, Y. H., T.Sudo, T. S., M.Mukai, M. M., & Sudo, T. (1995). Prediction of Thermal Fatigue Life for Encapsulated Flip-chip Interconnection,”. ISHM'95, 247-252.