Present and future directions for multichip module technologies

Toshio Sudo

Research output: Contribution to journalArticle

Abstract

Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.

Original languageEnglish
Pages (from-to)684-690
Number of pages7
JournalIEICE Transactions on Electronics
VolumeE78-C
Issue number6
Publication statusPublished - 1995 Jun

Fingerprint

Multichip modules
Electric wiring
Substrates
Temperature control
Fabrication
Thin films
Direction compound

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Present and future directions for multichip module technologies. / Sudo, Toshio.

In: IEICE Transactions on Electronics, Vol. E78-C, No. 6, 06.1995, p. 684-690.

Research output: Contribution to journalArticle

@article{59c9c8f4dd9b4a24a1f666b130c525a4,
title = "Present and future directions for multichip module technologies",
abstract = "Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.",
author = "Toshio Sudo",
year = "1995",
month = "6",
language = "English",
volume = "E78-C",
pages = "684--690",
journal = "IEICE Transactions on Electronics",
issn = "0916-8524",
publisher = "Maruzen Co., Ltd/Maruzen Kabushikikaisha",
number = "6",

}

TY - JOUR

T1 - Present and future directions for multichip module technologies

AU - Sudo, Toshio

PY - 1995/6

Y1 - 1995/6

N2 - Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.

AB - Multichip modules (MCM's) have been actively developed in recent years. They are expected to provide high-performance systems by packing bare chips at a high density. In particular, a thin-film interconnect substrate that can accommodate higher wiring capacity in a few layers is a new option for coping with high pin count and fine pad pitch VLSI's. MCM's require various kinds of technologies including the fabrication processes of interconnect substrates, chip connection methods, electrical design, thermal management, known good die (KGD), and so on. The state of the art of MCM technologies is reviewed and future directions are discussed.

UR - http://www.scopus.com/inward/record.url?scp=0029325618&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029325618&partnerID=8YFLogxK

M3 - Article

VL - E78-C

SP - 684

EP - 690

JO - IEICE Transactions on Electronics

JF - IEICE Transactions on Electronics

SN - 0916-8524

IS - 6

ER -