Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

ErPing Li, Xing-Chang Wei, A.C.Cangellaris A.C.Cangellaris, En-Xiao Liu, Yao-Jiang Zhang, M D'Amore, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)248-265
JournalIEEE Transactions on Electromagnetic Compatibility
Volume52
Publication statusPublished - 2010 May 1

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