Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

ErPing Li, Xing-Chang Wei, A.C.Cangellaris A.C.Cangellaris, En-Xiao Liu, Yao-Jiang Zhang, M D'Amore, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)248-265
JournalIEEE Transactions on Electromagnetic Compatibility
Volume52
Publication statusPublished - 2010 May 1

Cite this

Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects. / Li, ErPing; Wei, Xing-Chang; A.C.Cangellaris, A.C.Cangellaris; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, M; Sudo, Toshio.

In: IEEE Transactions on Electromagnetic Compatibility, Vol. 52, 01.05.2010, p. 248-265.

Research output: Contribution to journalArticle

Li, ErPing ; Wei, Xing-Chang ; A.C.Cangellaris, A.C.Cangellaris ; Liu, En-Xiao ; Zhang, Yao-Jiang ; D'Amore, M ; Sudo, Toshio. / Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects. In: IEEE Transactions on Electromagnetic Compatibility. 2010 ; Vol. 52. pp. 248-265.
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