Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

ErPing Li, Xing-Chang Wei, A.C.Cangellaris A.C.Cangellaris, En-Xiao Liu, Yao-Jiang Zhang, M D'Amore, Toshio Sudo

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	248-265
Journal	IEEE Transactions on Electromagnetic Compatibility
Volume	52
Publication status	Published - 2010 May 1

Cite this

@article{352237265d0f4b36b12d26d0d78e3cce,

title = "Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects",

author = "ErPing Li and Xing-Chang Wei and A.C.Cangellaris A.C.Cangellaris and En-Xiao Liu and Yao-Jiang Zhang and M D'Amore and Toshio Sudo",

year = "2010",

month = may,

day = "1",

language = "English",

volume = "52",

pages = "248--265",

journal = "IEEE Transactions on Electromagnetic Compatibility",

issn = "0018-9375",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Progress Review of Electromagnetic Comapatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

AU - Li, ErPing

AU - Wei, Xing-Chang

AU - A.C.Cangellaris, A.C.Cangellaris

AU - Liu, En-Xiao

AU - Zhang, Yao-Jiang

AU - D'Amore, M

AU - Sudo, Toshio

PY - 2010/5/1

Y1 - 2010/5/1

M3 - Article

SN - 0018-9375

VL - 52

SP - 248

EP - 265

JO - IEEE Transactions on Electromagnetic Compatibility

JF - IEEE Transactions on Electromagnetic Compatibility

ER -