Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects

Er Ping Li, Xing Chang Wei, Andreas C. Cangellaris, En Xiao Liu, Yao Jiang Zhang, Marcello D'amore, Joungho Kim, Toshio Sudo

Research output: Contribution to journalReview article

127 Citations (Scopus)


The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

Original languageEnglish
Article number5464324
Pages (from-to)248-265
Number of pages18
JournalIEEE Transactions on Electromagnetic Compatibility
Issue number2
Publication statusPublished - 2010 May 1



  • Electromagnetic compatibility (EMC)
  • Electronic package
  • Nanointerconnect (nano-INC)
  • Power integrity (PI)
  • Printed circuit board (PCB)
  • Signal integrity (SI)
  • Through-silicon vias (TSVs)

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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