Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects

Er Ping Li, Xing Chang Wei, Andreas C. Cangellaris, En Xiao Liu, Yao Jiang Zhang, Marcello D'amore, Joungho Kim, Toshio Sudo

Research output: Contribution to journalReview articlepeer-review

152 Citations (Scopus)

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Physics & Astronomy

Engineering & Materials Science