| Original language | English |
|---|---|
| Pages (from-to) | 15-21 |
| Journal | Thin Solid Films |
| Volume | 249 |
| Publication status | Published - 1994 Sep 1 |
Cite this
T.Homma, T. H., Y.Murao, Y. M., & Homma, T. (1994). Properties of Liquid Phase Deposited SiO2 Films for Interlayer Dielectrics in Ultra-large-scale Integrated Circuit Multilevel Interconnections. Thin Solid Films, 249, 15-21.