Proposed configuration of integrated optical isolator employing wafer-direct bonding technique

Hideki Yokoi, T. Mizumoto

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

A novel configuration of an intergrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of a wafer-direct bonding technique. Magnetic garnets with a large magneto-optic effect miniaturise the size of the nonreciprocal phase shifter to several hundreds of microns.

Original languageEnglish
Pages (from-to)1787-1788
Number of pages2
JournalElectronics Letters
Volume33
Issue number21
Publication statusPublished - 1997 Oct 9
Externally publishedYes

Fingerprint

Garnets
Magnetooptical effects
Phase shifters
Phase shift

Keywords

  • Optical isolators
  • Wafer bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Proposed configuration of integrated optical isolator employing wafer-direct bonding technique. / Yokoi, Hideki; Mizumoto, T.

In: Electronics Letters, Vol. 33, No. 21, 09.10.1997, p. 1787-1788.

Research output: Contribution to journalArticle

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