Quarter-micron Cu metallization using ultra-thin TiN barrier layers

K.Ueno K.Ueno, K.Ohta K.Ohta, K.Tsunenari K.Tsunenari, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)95-101
JournalAdvanced Metallization for ULSI Applications in 1994
Publication statusPublished - 1994 Oct 1

Cite this

Quarter-micron Cu metallization using ultra-thin TiN barrier layers. / K.Ueno, K.Ueno; K.Ohta, K.Ohta; K.Tsunenari, K.Tsunenari; Ueno, Kazuyoshi.

In: Advanced Metallization for ULSI Applications in 1994, 01.10.1994, p. 95-101.

Research output: Contribution to journalArticle

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AU - Ueno, Kazuyoshi

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