Abstract
This paper reports experimental results on far-field radiated emission for different on-chip chip power supply networks. Two types of test chips were developed as noise generators. One was with on-chip decoupling capacitance, and the other was without intentional on-chip decoupling capacitance. They were assembled in a CSP (Chip scale package). The effects of on-chip decoupling capacitance on far-field radiated emission were investigated for the operation of core logic circuits and output buffer circuits. Reduced radiated emission was observed for every harmonics for the operation of core logic circuits by the on-chip decoupling capacitance. While, reduced radiated emission was observed for the even-order harmonics for the operation of output buffer circuits due to the existence of on-chip decoupling capacitance.
| Original language | English |
|---|---|
| Pages (from-to) | 3195-3199 |
| Number of pages | 5 |
| Journal | IEICE Transactions on Communications |
| Volume | E88-B |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2005 Aug |
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Keywords
- Core circuit
- On-chip decoupling capacitor
- Output buffer circuit
- Radiated emission
- Simultaneous switching noise
- Test chip
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Computer Networks and Communications
Cite this
Radiated harmonics characterization of CMOS test chip with on-chip decoupling capacitance. / Sudo, Toshio.
In: IEICE Transactions on Communications, Vol. E88-B, No. 8, 08.2005, p. 3195-3199.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Radiated harmonics characterization of CMOS test chip with on-chip decoupling capacitance
AU - Sudo, Toshio
PY - 2005/8
Y1 - 2005/8
N2 - This paper reports experimental results on far-field radiated emission for different on-chip chip power supply networks. Two types of test chips were developed as noise generators. One was with on-chip decoupling capacitance, and the other was without intentional on-chip decoupling capacitance. They were assembled in a CSP (Chip scale package). The effects of on-chip decoupling capacitance on far-field radiated emission were investigated for the operation of core logic circuits and output buffer circuits. Reduced radiated emission was observed for every harmonics for the operation of core logic circuits by the on-chip decoupling capacitance. While, reduced radiated emission was observed for the even-order harmonics for the operation of output buffer circuits due to the existence of on-chip decoupling capacitance.
AB - This paper reports experimental results on far-field radiated emission for different on-chip chip power supply networks. Two types of test chips were developed as noise generators. One was with on-chip decoupling capacitance, and the other was without intentional on-chip decoupling capacitance. They were assembled in a CSP (Chip scale package). The effects of on-chip decoupling capacitance on far-field radiated emission were investigated for the operation of core logic circuits and output buffer circuits. Reduced radiated emission was observed for every harmonics for the operation of core logic circuits by the on-chip decoupling capacitance. While, reduced radiated emission was observed for the even-order harmonics for the operation of output buffer circuits due to the existence of on-chip decoupling capacitance.
KW - Core circuit
KW - On-chip decoupling capacitor
KW - Output buffer circuit
KW - Radiated emission
KW - Simultaneous switching noise
KW - Test chip
UR - http://www.scopus.com/inward/record.url?scp=26044458292&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=26044458292&partnerID=8YFLogxK
U2 - 10.1093/ietcom/e88-b.8.3195
DO - 10.1093/ietcom/e88-b.8.3195
M3 - Article
VL - E88-B
SP - 3195
EP - 3199
JO - IEICE Transactions on Communications
JF - IEICE Transactions on Communications
SN - 0916-8516
IS - 8
ER -