Reducing signal transmission loss by low surface roughness

Taka Aki Okubo, Toshio Sudo, Toshihiro Hosoi, Hiroaki Tsuyoshi, Fujio Kuwako

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Higher-speed signal transmission is strongly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Original languageEnglish
Title of host publicationDesignCon 2014: Where the Chip Meets the Board
PublisherDesignCon 2014
Publication statusPublished - 2014
EventDesignCon 2014: Where the Chip Meets the Board - Santa Clara, CA
Duration: 2014 Jan 282014 Jan 31

Other

OtherDesignCon 2014: Where the Chip Meets the Board
CitySanta Clara, CA
Period14/1/2814/1/31

Fingerprint

Surface roughness
Copper
Printed circuit boards
Metal foil
Electric wiring
Dielectric losses
Scattering

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Human-Computer Interaction

Cite this

Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H., & Kuwako, F. (2014). Reducing signal transmission loss by low surface roughness. In DesignCon 2014: Where the Chip Meets the Board DesignCon 2014.

Reducing signal transmission loss by low surface roughness. / Okubo, Taka Aki; Sudo, Toshio; Hosoi, Toshihiro; Tsuyoshi, Hiroaki; Kuwako, Fujio.

DesignCon 2014: Where the Chip Meets the Board. DesignCon 2014, 2014.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Okubo, TA, Sudo, T, Hosoi, T, Tsuyoshi, H & Kuwako, F 2014, Reducing signal transmission loss by low surface roughness. in DesignCon 2014: Where the Chip Meets the Board. DesignCon 2014, DesignCon 2014: Where the Chip Meets the Board, Santa Clara, CA, 14/1/28.
Okubo TA, Sudo T, Hosoi T, Tsuyoshi H, Kuwako F. Reducing signal transmission loss by low surface roughness. In DesignCon 2014: Where the Chip Meets the Board. DesignCon 2014. 2014
Okubo, Taka Aki ; Sudo, Toshio ; Hosoi, Toshihiro ; Tsuyoshi, Hiroaki ; Kuwako, Fujio. / Reducing signal transmission loss by low surface roughness. DesignCon 2014: Where the Chip Meets the Board. DesignCon 2014, 2014.
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