Reducing signal transmission loss by low surface roughness

Taka Aki Okubo, Toshio Sudo, Toshihiro Hosoi, Hiroaki Tsuyoshi, Fujio Kuwako

Research output: Contribution to conferencePaper

Abstract

Higher-speed signal transmission is strongly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Original languageEnglish
Publication statusPublished - 2014 Jan 1
EventDesignCon 2014: Where the Chip Meets the Board - Santa Clara, CA, United States
Duration: 2014 Jan 282014 Jan 31

Conference

ConferenceDesignCon 2014: Where the Chip Meets the Board
CountryUnited States
CitySanta Clara, CA
Period14/1/2814/1/31

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Human-Computer Interaction

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  • Cite this

    Okubo, T. A., Sudo, T., Hosoi, T., Tsuyoshi, H., & Kuwako, F. (2014). Reducing signal transmission loss by low surface roughness. Paper presented at DesignCon 2014: Where the Chip Meets the Board, Santa Clara, CA, United States.