Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,

K.Nakano K.Nakano, T.Sudo T.Sudo, S.Haga S.Haga, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalIEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging
Publication statusPublished - 2003 Oct 25

Cite this

Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor, / K.Nakano, K.Nakano; T.Sudo, T.Sudo; S.Haga, S.Haga; Sudo, Toshio.

In: IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, 25.10.2003.

Research output: Contribution to journalArticle

@article{5c7c1880705246dab95b498fcd8ad3f2,
title = "Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,",
author = "K.Nakano K.Nakano and T.Sudo T.Sudo and S.Haga S.Haga and Toshio Sudo",
year = "2003",
month = "10",
day = "25",
language = "English",
journal = "IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging",

}

TY - JOUR

T1 - Reduction in Radiated Emission Using CSP with Built-in Decoupling Capacitor,

AU - K.Nakano, K.Nakano

AU - T.Sudo, T.Sudo

AU - S.Haga, S.Haga

AU - Sudo, Toshio

PY - 2003/10/25

Y1 - 2003/10/25

M3 - Article

JO - IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging

JF - IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging

ER -