Relation between plasma-induced damage to SiO2 film and high energy particles in plasma processing

F. Tochikubo, T. Watanabe, H. Nishikawa, E. Watanabe, D. Ito, T. Okumura, H. Kaibe

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)21-30
JournalMemoirs of Faculty of Engineering
Publication statusPublished - 1997 Jan 1

Cite this

Relation between plasma-induced damage to SiO2 film and high energy particles in plasma processing. / Tochikubo, F.; Watanabe, T.; Nishikawa, H.; Watanabe, E.; Ito, D.; Okumura, T.; Kaibe, H.

In: Memoirs of Faculty of Engineering, 01.01.1997, p. 21-30.

Research output: Contribution to journalArticle

Tochikubo, F. ; Watanabe, T. ; Nishikawa, H. ; Watanabe, E. ; Ito, D. ; Okumura, T. ; Kaibe, H. / Relation between plasma-induced damage to SiO2 film and high energy particles in plasma processing. In: Memoirs of Faculty of Engineering. 1997 ; pp. 21-30.
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AU - Kaibe, H.

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