Reliability of Flip-chip Interconnection by Eutectic Solder Bumps

Y.Hiruta Y.Hiruta, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalIEEE VLSI Packaging Workshop, Montrey
Publication statusPublished - 1995 Oct 25

Cite this

Y.Hiruta, Y. H., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., T.Sudo, T. S., & Sudo, T. (1995). Reliability of Flip-chip Interconnection by Eutectic Solder Bumps. IEEE VLSI Packaging Workshop, Montrey.

Reliability of Flip-chip Interconnection by Eutectic Solder Bumps. / Y.Hiruta, Y.Hiruta; K.Doi, K.Doi; N.Hirano, N.Hirano; T.Okada, T.Okada; T.Sudo, T.Sudo; Sudo, Toshio.

In: IEEE VLSI Packaging Workshop, Montrey, 25.10.1995.

Research output: Contribution to journalArticle

Y.Hiruta, YH, K.Doi, KD, N.Hirano, NH, T.Okada, TO, T.Sudo, TS & Sudo, T 1995, 'Reliability of Flip-chip Interconnection by Eutectic Solder Bumps', IEEE VLSI Packaging Workshop, Montrey.
Y.Hiruta YH, K.Doi KD, N.Hirano NH, T.Okada TO, T.Sudo TS, Sudo T. Reliability of Flip-chip Interconnection by Eutectic Solder Bumps. IEEE VLSI Packaging Workshop, Montrey. 1995 Oct 25.
Y.Hiruta, Y.Hiruta ; K.Doi, K.Doi ; N.Hirano, N.Hirano ; T.Okada, T.Okada ; T.Sudo, T.Sudo ; Sudo, Toshio. / Reliability of Flip-chip Interconnection by Eutectic Solder Bumps. In: IEEE VLSI Packaging Workshop, Montrey. 1995.
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