Reliability of Flip-chip Interconnection by Eutectic Solder Bumps

Y.Hiruta Y.Hiruta, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
JournalIEEE VLSI Packaging Workshop, Montrey
Publication statusPublished - 1995 Oct 25

Cite this

Y.Hiruta, Y. H., K.Doi, K. D., N.Hirano, N. H., T.Okada, T. O., T.Sudo, T. S., & Sudo, T. (1995). Reliability of Flip-chip Interconnection by Eutectic Solder Bumps. IEEE VLSI Packaging Workshop, Montrey.