Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs

Hirohiko Sugahara; Masakatsu Kimizuka; Yoshino K. Fukai; Makoto Hirano; Fumiaki Hyuga

doi:10.1016/S0026-2714(97)00133-9

Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs

Hirohiko Sugahara, Masakatsu Kimizuka, Yoshino K. Fukai, Makoto Hirano, Fumiaki Hyuga

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

This paper discusses the reliability of three-dimensional Au/WSiN interconnections buried in a polyimide layer. Temperature cycle tests and bias stress tests reveal the high stability of this system. It is found that the enhanced degradation occurs at the Au/WSiN viahole contacts, which strongly depends on the current density. SEM analysis reveals the void formation in the Au layer near the Au-WSiN interface, which can be explained by the dam effect created by the WSiN layer.

Original language	English
Pages (from-to)	1659-1662
Number of pages	4
Journal	Microelectronics Reliability
Volume	37
Issue number	10-11
DOIs	https://doi.org/10.1016/S0026-2714(97)00133-9
Publication status	Published - 1997 Jan 1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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title = "Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs",

abstract = "This paper discusses the reliability of three-dimensional Au/WSiN interconnections buried in a polyimide layer. Temperature cycle tests and bias stress tests reveal the high stability of this system. It is found that the enhanced degradation occurs at the Au/WSiN viahole contacts, which strongly depends on the current density. SEM analysis reveals the void formation in the Au layer near the Au-WSiN interface, which can be explained by the dam effect created by the WSiN layer.",

author = "Hirohiko Sugahara and Masakatsu Kimizuka and Fukai, {Yoshino K.} and Makoto Hirano and Fumiaki Hyuga",

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AU - Sugahara, Hirohiko

AU - Kimizuka, Masakatsu

AU - Fukai, Yoshino K.

AU - Hirano, Makoto

AU - Hyuga, Fumiaki

PY - 1997/1/1

Y1 - 1997/1/1

N2 - This paper discusses the reliability of three-dimensional Au/WSiN interconnections buried in a polyimide layer. Temperature cycle tests and bias stress tests reveal the high stability of this system. It is found that the enhanced degradation occurs at the Au/WSiN viahole contacts, which strongly depends on the current density. SEM analysis reveals the void formation in the Au layer near the Au-WSiN interface, which can be explained by the dam effect created by the WSiN layer.

AB - This paper discusses the reliability of three-dimensional Au/WSiN interconnections buried in a polyimide layer. Temperature cycle tests and bias stress tests reveal the high stability of this system. It is found that the enhanced degradation occurs at the Au/WSiN viahole contacts, which strongly depends on the current density. SEM analysis reveals the void formation in the Au layer near the Au-WSiN interface, which can be explained by the dam effect created by the WSiN layer.

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JO - Microelectronics and Reliability

JF - Microelectronics and Reliability

IS - 10-11

ER -

Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs

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ASJC Scopus subject areas

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