Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs

Hirohiko Sugahara, Masakatsu Kimizuka, Yoshino K. Fukai, Makoto Hirano, Fumiaki Hyuga

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper discusses the reliability of three-dimensional Au/WSiN interconnections buried in a polyimide layer. Temperature cycle tests and bias stress tests reveal the high stability of this system. It is found that the enhanced degradation occurs at the Au/WSiN viahole contacts, which strongly depends on the current density. SEM analysis reveals the void formation in the Au layer near the Au-WSiN interface, which can be explained by the dam effect created by the WSiN layer.

Original languageEnglish
Pages (from-to)1659-1662
Number of pages4
JournalMicroelectronics Reliability
Volume37
Issue number10-11
Publication statusPublished - 1997 Oct
Externally publishedYes

Fingerprint

Monolithic microwave integrated circuits
Polyimides
Dams
Current density
Degradation
Scanning electron microscopy
dams
polyimides
Temperature
voids
current density
degradation
cycles
scanning electron microscopy
temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Sugahara, H., Kimizuka, M., Fukai, Y. K., Hirano, M., & Hyuga, F. (1997). Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs. Microelectronics Reliability, 37(10-11), 1659-1662.

Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs. / Sugahara, Hirohiko; Kimizuka, Masakatsu; Fukai, Yoshino K.; Hirano, Makoto; Hyuga, Fumiaki.

In: Microelectronics Reliability, Vol. 37, No. 10-11, 10.1997, p. 1659-1662.

Research output: Contribution to journalArticle

Sugahara, H, Kimizuka, M, Fukai, YK, Hirano, M & Hyuga, F 1997, 'Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs', Microelectronics Reliability, vol. 37, no. 10-11, pp. 1659-1662.
Sugahara H, Kimizuka M, Fukai YK, Hirano M, Hyuga F. Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs. Microelectronics Reliability. 1997 Oct;37(10-11):1659-1662.
Sugahara, Hirohiko ; Kimizuka, Masakatsu ; Fukai, Yoshino K. ; Hirano, Makoto ; Hyuga, Fumiaki. / Reliability study on three-dimensional Au/WSiN interconnections for ultra-compact MMICs. In: Microelectronics Reliability. 1997 ; Vol. 37, No. 10-11. pp. 1659-1662.
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