Reliability tests of electroless barriers against copper diffusion under bias temperature stress with n- and p-type substrates

M. Yamashita, S. Fujishima, A. Mitsumori, K. Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)58-59
JournalExtended Abstracts of Advanced Metallization Coference 2012: 22nd Asian Session
Publication statusPublished - 2012 Oct 23

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