Reliability tests of electroless barriers against copper diffusion under bias temperature stress with n- and p-type substrates

M. Yamashita, S. Fujishima, A. Mitsumori, K. Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)58-59
JournalExtended Abstracts of Advanced Metallization Coference 2012: 22nd Asian Session
Publication statusPublished - 2012 Oct 23

Cite this

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title = "Reliability tests of electroless barriers against copper diffusion under bias temperature stress with n- and p-type substrates",
author = "M. Yamashita and S. Fujishima and A. Mitsumori and K. Ueno",
year = "2012",
month = "10",
day = "23",
language = "English",
pages = "58--59",
journal = "Extended Abstracts of Advanced Metallization Coference 2012: 22nd Asian Session",

}

TY - JOUR

T1 - Reliability tests of electroless barriers against copper diffusion under bias temperature stress with n- and p-type substrates

AU - Yamashita, M.

AU - Fujishima, S.

AU - Mitsumori, A.

AU - Ueno, K.

PY - 2012/10/23

Y1 - 2012/10/23

M3 - Article

SP - 58

EP - 59

JO - Extended Abstracts of Advanced Metallization Coference 2012: 22nd Asian Session

JF - Extended Abstracts of Advanced Metallization Coference 2012: 22nd Asian Session

ER -