Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs

Hirohiko Sugawara, Makoto Hirano

    Research output: Contribution to journalArticle

    Original languageEnglish
    JournalMicroelectronics and Reliability
    Publication statusPublished - 1997 Apr 1

    Cite this

    Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs. / Sugawara, Hirohiko; Hirano, Makoto.

    In: Microelectronics and Reliability, 01.04.1997.

    Research output: Contribution to journalArticle

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    title = "Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs",
    author = "Hirohiko Sugawara and Makoto Hirano",
    year = "1997",
    month = "4",
    day = "1",
    language = "English",
    journal = "Microelectronics and Reliability",

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    T1 - Reliablity Study on Three-Dimensional Au/WSiN Interconnections for Ultra-Compact MMICs

    AU - Sugawara, Hirohiko

    AU - Hirano, Makoto

    PY - 1997/4/1

    Y1 - 1997/4/1

    M3 - Article

    JO - Microelectronics and Reliability

    JF - Microelectronics and Reliability

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