Seed effect on self-annealing of electroplated copper films

K.Ueno K.Ueno, T.Ritzdorf T.Ritzdorf, S.Grace S.Grace, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
JournalAbstract of Advanced Metallization Conference in 1998
Publication statusPublished - 1998 Oct 6

Cite this

Seed effect on self-annealing of electroplated copper films. / K.Ueno, K.Ueno; T.Ritzdorf, T.Ritzdorf; S.Grace, S.Grace; Ueno, Kazuyoshi.

In: Abstract of Advanced Metallization Conference in 1998, 06.10.1998.

Research output: Contribution to journalArticle

@article{f362cbef53ee400c80fe57e317fb67f8,
title = "Seed effect on self-annealing of electroplated copper films",
author = "K.Ueno K.Ueno and T.Ritzdorf T.Ritzdorf and S.Grace S.Grace and Kazuyoshi Ueno",
year = "1998",
month = "10",
day = "6",
language = "English",
journal = "Abstract of Advanced Metallization Conference in 1998",

}

TY - JOUR

T1 - Seed effect on self-annealing of electroplated copper films

AU - K.Ueno, K.Ueno

AU - T.Ritzdorf, T.Ritzdorf

AU - S.Grace, S.Grace

AU - Ueno, Kazuyoshi

PY - 1998/10/6

Y1 - 1998/10/6

M3 - Article

JO - Abstract of Advanced Metallization Conference in 1998

JF - Abstract of Advanced Metallization Conference in 1998

ER -