Silicon-based low-dimensional materials for thermal conductivity suppression: Recent advances and new strategies to high thermoelectric efficiency

Huajun Lai, Ying Peng, Jie Gao, Masashi Kurosawa, Osamu Nakatsuka, Tsunehiro Takeuchi, Lei Miao

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Silicon-based low-dimensional materials for thermal conductivity suppression: Recent advances and new strategies to high thermoelectric efficiency'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science