Silicon surface processing techniques for micro-systems fabrication

Vygantas Mizeikis, Saulius Juodkazis, Jia Yu Ye, Andrei Rode, Shigeki Matsuo, Hiroaki Misawa

Research output: Contribution to journalConference article

15 Citations (Scopus)

Abstract

Micromachining of silicon surface and near-surface regions by electron-beam lithography (EBL) and reactive ion dry-etching (RIE), as well as by laser microfabrication techniques is described. Combination of EBL and RIE techniques is used to fabricate quasi two-dimensional (2D) photonic crystal (PhC) structures with aspect ratios at approximately 15. Structural and optical properties of PhC samples with 2D honeycomb lattice are reported, and a complete photonic band gap at wavelengths approximately 2.16 μm is identified from the optical transmission data. Next, laser microfabrication of silicon by femtosecond laser pulses is reported. Processing of silicon under low air pressure conditions (≃5 Torr) is demonstrated to be essentially debris-free process, highly suitable for cutting and scribing of wafers as well for hole drilling. Removal of thin films from the silicon surface by a single-shot laser ablation using mask projection is also demonstrated.

Original languageEnglish
Pages (from-to)445-451
Number of pages7
JournalThin Solid Films
Volume438-439
DOIs
Publication statusPublished - 2003 Aug 22
EventThe 5th International Conference on Nano-Molecular Electronics - Kobe, Japan
Duration: 2002 Dec 102002 Dec 12

    Fingerprint

Keywords

  • Laser ablation
  • Nanostructures
  • Optoelectronic devices
  • Silicon

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this