Simplified and practical estimation of package cracking during reflow soldering process

K. Sawada, T. Nakazawa, N. Kawamura, K. Matsumoto, Y. Hiruta, T. Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.

Original languageEnglish
Title of host publicationAnnual Proceedings - Reliability Physics (Symposium)
PublisherPubl by IEEE
Pages114-119
Number of pages6
ISBN (Print)0780313577
Publication statusPublished - 1994 Jan 1
EventProceedings of the 32nd Annual International Reliability Physics Proceedings - San Jose, CA, USA
Duration: 1994 Apr 121994 Apr 14

Publication series

NameAnnual Proceedings - Reliability Physics (Symposium)
ISSN (Print)0099-9512

Other

OtherProceedings of the 32nd Annual International Reliability Physics Proceedings
CitySan Jose, CA, USA
Period94/4/1294/4/14

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Sawada, K., Nakazawa, T., Kawamura, N., Matsumoto, K., Hiruta, Y., & Sudo, T. (1994). Simplified and practical estimation of package cracking during reflow soldering process. In Annual Proceedings - Reliability Physics (Symposium) (pp. 114-119). (Annual Proceedings - Reliability Physics (Symposium)). Publ by IEEE.