Simulation of Coupling Effects Among Multiconductor Lines on a Thin Film Multichip Module,

J.Kudo J.Kudo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)330-333
JournalIEMT Japan Symposium
Publication statusPublished - 1991 May 25

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