Simulation of Coupling Effects Among Multiconductor Lines on a Thin Film Multichip Module,

J.Kudo J.Kudo, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)330-333
JournalIEMT Japan Symposium
Publication statusPublished - 1991 May 25

Cite this

Simulation of Coupling Effects Among Multiconductor Lines on a Thin Film Multichip Module, / J.Kudo, J.Kudo; T.Sudo, T.Sudo; Sudo, Toshio.

In: IEMT Japan Symposium, 25.05.1991, p. 330-333.

Research output: Contribution to journalArticle

J.Kudo, J.Kudo ; T.Sudo, T.Sudo ; Sudo, Toshio. / Simulation of Coupling Effects Among Multiconductor Lines on a Thin Film Multichip Module,. In: IEMT Japan Symposium. 1991 ; pp. 330-333.
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