Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer

Yuhei Imai, Hiroyuki Manabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.

Original languageEnglish
Title of host publicationAdjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
PublisherAssociation for Computing Machinery, Inc
Pages126-128
Number of pages3
ISBN (Electronic)9781450386555
DOIs
Publication statusPublished - 2021 Oct 10
Event34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021 - Virtual, Online, United States
Duration: 2021 Oct 102021 Oct 14

Publication series

NameAdjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021

Conference

Conference34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
Country/TerritoryUnited States
CityVirtual, Online
Period21/10/1021/10/14

Keywords

  • 3D printer
  • hot stamping
  • Multi-layer electric circuit
  • silver paste
  • transfer foil

ASJC Scopus subject areas

  • Software
  • Human-Computer Interaction

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