STRAIN ANALYSES OF NONLINEAR CRACK BEHAVIOR AT ELEVATED TEMPERATURE BY FINITE ELEMENT METHOD AND MOIRE TOPOGRAPHICAL METHOD.

T. Aizawa, G. Yagawa, Y. Ando

Research output: Contribution to conferencePaperpeer-review

Abstract

In this paper, the measurement scheme for strain analyses presented is the Moire topographical method aided by picture processing with the use of computer. The picture processing technique enables analysis of nonlinear behavior of crack growth under elevated temperature from different points of view. Finite element methods are utilized to calculate the creep crack growth with the large-displacement formulation.

Original languageEnglish
Publication statusPublished - 2017 Jan 1
EventUnknown conference - Berlin, Ger
Duration: 1979 Aug 131979 Aug 17

Other

OtherUnknown conference
CityBerlin, Ger
Period79/8/1379/8/17

ASJC Scopus subject areas

  • Engineering(all)

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