Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

M.Kawano M.Kawano, T.Fukase T.Fukase, Y.Yamamoto Y.Yamamoto, T.Ito T.Ito, S.Yokogawa S.Yokogawa, H.Tsuda H.Tsuda, Y.Kunimune Y.Kunimune, T.Saitoh T.Saitoh, K.Ueno K.Ueno, Kazuyoshi Ueno

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)
Original languageEnglish
Pages (from-to)210-212
JournalProc. 2003 International Interconnect Technology conference
Publication statusPublished - 2003 Jun 1

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