Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding

M.Kawano M.Kawano, T.Fukase T.Fukase, Y.Yamamoto Y.Yamamoto, T.Ito T.Ito, S.Yokogawa S.Yokogawa, H.Tsuda H.Tsuda, Y.Kunimune Y.Kunimune, T.Saitoh T.Saitoh, K.Ueno K.Ueno, Kazuyoshi Ueno

Research output: Contribution to journalArticle

22 Citations (Scopus)
Original languageEnglish
Pages (from-to)210-212
JournalProc. 2003 International Interconnect Technology conference
Publication statusPublished - 2003 Jun 1

Cite this

M.Kawano, M. K., T.Fukase, T. F., Y.Yamamoto, Y. Y., T.Ito, T. I., S.Yokogawa, S. Y., H.Tsuda, H. T., Y.Kunimune, Y. K., T.Saitoh, T. S., K.Ueno, K. U., & Ueno, K. (2003). Stress relaxation in dual-damascene Cu interconnects to suppress stress-induced voiding. Proc. 2003 International Interconnect Technology conference, 210-212.